References
- T. Kobayashi, J. Kawasaki, J. Ishibashi, K. Tanaka and H. Honma: J. Surf Finish. Soc. Jpn, 1998, 49, (12), 1332–1335.
- H. Nawafune, K. Kitamura, S. Mizumoto and T. Okada: J. Surf Finish. Soc. Jpn, 2000, 51, (11), 1142–1147.
- K. Kondo, Y. Tanaka and K. Mano: J. Jpn Inst. Electron. Packag., 2001, 4, (1), 37–40.
- Y. Takasaki: J. Jpn Inst. Electron. Packag., 1999, 2, (6), 450–453.
- C.-C. Yeh, K.-H. Lan, W.-P. Dow, J.-H. Hsu, C. Lee, C.-H. Hsu, K. Lee, J. Chen and P. Lu: Circuit World, 2004, 30, (3), 26–32.
- T. P. Moffat, J. E. Bonevich, W. H. Huber, A. Stanishevsky, D. R. Kelly, G. R. Stafford and D. Josell: J. Electrochem. Soc., 2000, 147, (12), 4524–4535.
- K. Kondo, T. Matsumoto and K. Watanabe: Electrochem. Soc., 2004, 151, C250—C255.
- Y. Tsukada: IEMTIIMC Proc., 1997, 5–9.
- M. Lefebvre, G. Allardyce, M. Seita, H. Tsuchida, M. Kusaka and S. Hayashi: Circuit World, 2003, 29, 9–14.
- P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans and H. Deligianni: IBM J. Res. Develop., 1998, 42, 567.
- R. D. Mikkola, Q. T. Jiang and B. Carpenter: Plat. Surf Finish., 2000, 87, (3), 81.
- T. Kobayashi, J. Kawasaki, K. Mihara, T. Yamashita and H. Honma: J. Jpn Inst. Electron. Packag., 2000, 3, (4), 324–329.
- Y. Takada, K. Oyamada, S. Miura and H. Honma: J. Jpn Inst. Electron. Packag., 2001, 4, (3), 219–224.
- S. Miura, K. Mihara, T. Hukushi and H. Honma: J. Jpn Inst. Electron. Packag., 2002, 5, (3), 246–251.
- Y. Negishi, M. Hasegawa, T. Nakanishi and T. Osaka: Proc. 109th Surf. Finish. Soc. Jpn Meet., March 2004, Tokyo, Japan, The Surface Finishing Society of Japan, 154–155.
- K. Kondo, T. Yonezawa, Y. Taguchi, M. Tomisaka, M. Hoshino and K. Takahashi: Proc. MES2003 Meet., October 2003, Osaka, Japan, Japan Institute of Electronics Packaging, 256–259.
- J. Tokunaga and Y. Tsuru: Proc. 16th JIEP Ann. Meet., Yokohama, Japan, March 2002, Japan Institute of Electronics Packaging, 3–4.
- J. Kelly and A. West: J. Electrochem. Soc., 1998, 145, 3472.
- K. Hayashi, Y. Tanaka and K. Kondo: Proc. 14th JIEP Ann. Meet., Yokohama, Japan, March 2000, Japan Institute of Electronics Packaging, 127–128.
- K. Ishii: Proc. 3rd Asian Surf. Finish. Forum, Seoul, Korea, September 1989, The Metal Finishing Society of Korea, 97–104.
- M. Moriyama, K. Matsunaga, T. Morita, S. Tsukimoto and M. Murakami: Mater. Trans., 2004, 45, (10), 3033–3038.
- M. Yokoi and S. Konishi: J. Met. Finish. Soc. Jpn, 1984, 35(10), 480–481.
- H. Brown and R. A. Fellows: US Patent 2707166, 1955.
- J. J.Kelly, C. Tian and A. C. West: J. Electrochem. Soc., 1998, 146, 2540.