References
- M. Jordan: 'The electrodeposition of tin and its alloys', 19–59; 1995, Saulgau, Eugen G. Leuze Publishers.
- F. A. Lowenheim: 'Electroplating', 311; 1995, Bristol, Technical Reference Publications.
- Y. Liu and M. Pritzker: J. Appl. Electrochem., 2003, 33, 1143–1153.
- K. L. Lin and L. M. Sun: J. Mater. Res., 2003, 18, 2203–2207.
- J. C. Puippe and F. Leaman (eds.): 'Theory and practice of pulse plating', 192; 1986, Orlando, FL, American Electroplaters and Surface Finishers Society.
- C. S. Chen, C. C. Wan and Y. Y. Wang: Trans. IMF, 1998, 76, 56.
- C. A. Gervasi, F. E. Varela, J. R. Vilche and P. E. Alvarez: Electrochim. Acta, 1997, 42, 537–547.
- L. Peter, Q. Liu, Z. Kerner and I. Bakonyi: Electrochim. Acta, 2004, 49, 1513–1526.
- M. Halmdienst, W. E. G. Hansal, G. Kaltenhauser and W. Kautek: Trans. IMF, 2007, 85, 22–26.
- W. E. G. Hansal et al.: Electrochimica Acta, 2006, 52, 1145–1151.
- C. Kerr: Proc. AESF Interfinish Conf., Chicago, IL, USA, June 2004, AESF.
- P. E. Alvarez and C. A. Gervasi: Corros. Sci., 2004, 46, 91–107.