- H. LINDSAY: in ‘The AESF shop guide’, 9th edn, 61; 1991, Orlando, FL, American Electroplaters and Surface Finishers Society.
- F. ALTMAYER: Plat. Surf. Finish., 1993, 26, 40.
- M. CARANO: in ‘The AESF shop guide’, 9th edn, 143; 1991, Orlando, FL, American Electroplaters and Surface Finishers Society.
- A. BLAIR: in ‘The AESF shop guide’, 9th edn, 136; 1991, Orlando, FL, American Electroplaters and Surface Finishers Society.
- G. A. MARI: in ‘The AESF shop guide’, 9th edn, 115; 1991, Orlando, FL, American Electroplaters and Surface Finishers Society.
- B. L. HALPERN and J. J. SCHIVARR: in ‘Handbook of deposition technologies for films and coatings’, (ed. R. F. Bunshah), 2nd edn, 823; 1994, Park Ridge, NJ, Noyes Publications.
- B. L. HALPERN: J. Colloid Interface Sci., 1982, 86, 337.
- J. J. scrimmr: US Patent 4 788 082.
- J. J. sormirr and B. L. HALPERN: US Patent 5 256 205.
- B. L. HALPERN and J. J. SCHMITT: J. Vac. Sci. Technol., 1994, 12, (4), 1623.
- B. L. HALPERN, J. J. SCHMITT, Y. DI, J. W. GOLZ, D. L. JOHNSON, D. T. McAVOY, D. WANG, and J.-Z. ZHANG: Met. Finish., Dec. 1992, 37.
- C.-L. HWANG, B. A. CHEN, T. P. MA, J. W. GOLZ, Y. DI, B. L. HALPERN, and J.J. SCHMITT: Integr. Ferroelectr., 1992, 2, 221.
- D. WANG, T. P. MA, J. W. GOLZ, B. L. HALPERN, and J. J. SCHMITT: IEEE Electron. Device Lett., 1992, 13, 482.
- L. M. HSIUNG, J.-Z. ZHANG, D. C. McINTYRE, J. W. GOLZ, B. L. HALPERN, J. J. SCHMITT, and H. G. N. WADLEY: SCr. Metall., 1993, 29, 293.
Surface Engineering
Volume 11, 1995 - Issue 1