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Fusion Science and Technology Volume 52, 2007 - Issue 3: Proceedings of the Seventeenth Topical Meeting on The Technology of Fusion Energy (Part 1) Albuquerque, New Mexico November 12–16, 2006
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Technical Paper

Grain Size Effect on Room Temperature Fatigue and Creep-Fatigue Behavior of OFHC Copper

Xiao PanDepartment of Nuclear, Plasma & Radiological Engineering, University of Illinois at Urbana-Champaign 214 Nuclear Engineering Laboratory, 103 South Goodwin Avenue, Urbana, Illinois 61801-2984
,
Xianglin WuDepartment of Nuclear, Plasma & Radiological Engineering, University of Illinois at Urbana-Champaign 214 Nuclear Engineering Laboratory, 103 South Goodwin Avenue, Urbana, Illinois 61801-2984
,
Geng FuDepartment of Nuclear, Plasma & Radiological Engineering, University of Illinois at Urbana-Champaign 214 Nuclear Engineering Laboratory, 103 South Goodwin Avenue, Urbana, Illinois 61801-2984
&
James F. StubbinsDepartment of Nuclear, Plasma & Radiological Engineering, University of Illinois at Urbana-Champaign 214 Nuclear Engineering Laboratory, 103 South Goodwin Avenue, Urbana, Illinois 61801-2984
Pages 521-525 | Published online: 07 Apr 2017

References

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  • G. LI, B.G. THOMAS, and J.F. STUBBINS, “Modeling Creep and Fatigue of Copper Alloys,” Met. and Mat. Trans. A., 31A, 2419–2502 (2000).
  • M. LI and J.F. STUBBINS, Journal of ASTM International, “Creep-Fatigue Behavior in High Strength Copper Alloys,” 2, 251–264 (2005).

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