References
- Matsuura T Environment Regulations in EU (WEEE & RoHS Directives) and USA J Surface Finishing Society of Japan 2003 54– 9 585–592 .
- Suganuma K ‘WEEE/RoHS directives and trends in lead-free soldering technology’ Industry and Environment 2002 31 12 67–74.
- Glazer J ‘Metallurgy of low temperature Pb-free solders for electronic assembly’ International Materials Reviews 1995 40 2 65 93 .
- Tu K N Zeng K ‘Reliability issues of Pb-free solder joints in electronic packaging technology’ Proc Electronic Components and Technology Conference 2002 52 1194–1200 .
- McCormack M Jin S ‘New lead-free solders’ J of Electronic Materials 1994 23 7 635–640.
- Sasaki S et al ‘Effects of laser pulse energy, defocus and twisted pitch of bundle on melting behaviour – Study on uniform melting of the bundle of Cu wires by YAG laser (1st Report) –’ Q J JWS 2003 21 1 19 24 .
- Sasaki S et al ‘Melting and cutting behaviour of the bundle of fine Cu wires – Study on uniform melting of the bundle of Cu wires by YAG laser (2nd Report) –’ Q J JWS 2004 22 2 248–253.
- Yasunaga N et al ‘Measurement of thermal and optical properties by cw CO2 laser light – Influence of surface conditions on the absorption of CO2 laser light on iron –’ J Japan Society of Precision Engineering 1985 51 12 2253–2258.
- Yasunaga N ‘Processing technology transformed by laser’ Kaibundo 1992 39 .