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Materials Research Letters
Volume 10, 2022 - Issue 9
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Original Reports
Dual heterogeneous structure facilitating an excellent strength-ductility combination in an additively manufactured multi-principal-element alloy
Jing Huanga State Key Laboratory of Powder Metallurgy, Central South University, Changsha, People’s Republic of China;b Department of Materials Science and Engineering, Hong Kong Institute for Advanced Study, City University of Hong Kong, Kowloon, Hong KongView further author information
, Wanpeng Lib Department of Materials Science and Engineering, Hong Kong Institute for Advanced Study, City University of Hong Kong, Kowloon, Hong KongView further author information
, Junyang Hea State Key Laboratory of Powder Metallurgy, Central South University, Changsha, People’s Republic of ChinaView further author information
, Rui Zhoub Department of Materials Science and Engineering, Hong Kong Institute for Advanced Study, City University of Hong Kong, Kowloon, Hong KongView further author information
, Tzu-Hsiu Choub Department of Materials Science and Engineering, Hong Kong Institute for Advanced Study, City University of Hong Kong, Kowloon, Hong KongView further author information
, Tao Yangb Department of Materials Science and Engineering, Hong Kong Institute for Advanced Study, City University of Hong Kong, Kowloon, Hong KongView further author information
, Chain-Tsuan Liub Department of Materials Science and Engineering, Hong Kong Institute for Advanced Study, City University of Hong Kong, Kowloon, Hong KongView further author information
, Weidong Zhangc College of Materials Science and Engineering, Hunan University, Changsha, People’s Republic of ChinaView further author information
, Yong Liua State Key Laboratory of Powder Metallurgy, Central South University, Changsha, People’s Republic of ChinaCorrespondence[email protected]
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& View further author information
Jacob C. Huangb Department of Materials Science and Engineering, Hong Kong Institute for Advanced Study, City University of Hong Kong, Kowloon, Hong KongCorrespondence[email protected]
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show allView further author information
Pages 575-584
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Received 29 Nov 2021, Published online: 03 May 2022
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