Comparative analysis of thermal interface materials for effective thermal management of electronic devices

References

• R. Pfahl and J. McElroy, “The 2004 international electronics manufacturing initiative (iNEMI) technology roadmaps,” in 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, IEEE, Jun. 2005, pp. 1–7. doi: 10.1109/HDP.2005.251376.
   Google Scholar
• C. V. Madhusudana, “Thermal contact conductance,” in Mechanical Engineering Series. Cham: Springer International Publishing, 2014. 10.1007/978-3-319-01276-6.
   Google Scholar
• B. Agostini, et al. “State of the art of high heat flux cooling technologies.” Heat Transfer Eng., vol. 28, no. 4, pp. 258–281, Apr 2007. doi:10.1080/01457630601117799.
   Web of Science ®Google Scholar
• J. B. Marcinichen, J. A. Olivier, N. Lamaison, and J. R. Thome, “Advances in electronics cooling,” Heat Transfer Eng., vol. 34, no. 5–6, pp. 434–446, Jan. 2013. DOI: 10.1080/01457632.2012.721316.
   Web of Science ®Google Scholar
• D. D. L. Chung, “Thermal interface materials,” J. Mater. Eng. Perform., vol. 10, no. 1, pp. 56–59, Feb. 2001. DOI: 10.1361/105994901770345358.
   Web of Science ®Google Scholar
• T. A. Howe, C.-K. Leong, and D. D. L. Chung, “Comparative evaluation of thermal interface materials for improving the thermal contact between an operating computer microprocessor and its heat sink,” J. Electron. Mater., vol. 35, no. 8, pp. 1628–1635, Aug. 2006. DOI: 10.1007/s11664-006-0209-7.
   Web of Science ®Google Scholar
• C. Lin, T. A. Howe, and D. D. L. Chung, “Electrically nonconductive thermal pastes with carbon as the thermally conductive component,” J. Electron. Mater., vol. 36, no. 6, pp. 659–668, Jun. 2007. DOI: 10.1007/s11664-007-0116-6.
   Web of Science ®Google Scholar
• W. Yu, et al. “Graphene based silicone thermal greases,” Phys. Lett. Sec. A: Gen. At. Solid State Phys., vol. 378, no. 3, pp. 207–211, Jan. 2014. DOI: 10.1016/j.physleta.2013.10.017.
   Google Scholar
• P. R. Devananda and K. Narayanprabhu, “The effect of load and addition of MWCNTs on silicone based TIMs on thermal contact heat transfer across Cu/Cu interface,” Mater. Res. Express, vol. 6, no. 11, pp. 1165h9, Nov. 2019. DOI: 10.1088/2053-1591/ab5236.
   Web of Science ®Google Scholar
• E. G. Wolff and D. A. Schneider, “Prediction of thermal contact resistance between polished surfaces,” Int. J. Heat Mass Transf., vol. 41, no. 22, pp. 3469–3482, Nov. 1998. DOI: 10.1016/S0017-9310(98)00067-2.
   Web of Science ®Google Scholar
• X. Zheng, D. Liu, D. Wei, and X. Shang, “Experimental investigation of high temperature thermal contact resistance with interface material,” Theor. Appl. Mech. Lett., vol. 1, no. 5, pp.051009, 2011. DOI: 10.1063/2.1105109.
   Google Scholar
• H. Yu, R. Zhang, L. Li, X. Mao, and H. Du, “Silver-based thermal interface materials with low thermal resistance,” in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, IEEE, Aug. 2012, pp. 410–413. doi: 10.1109/ICEPT-HDP.2012.6474646.
   Google Scholar
• T. Sakamoto, et al. “Selection and evaluation of thermal interface materials for reduction of the thermal contact resistance of thermoelectric generators.” J. Electron. Mater., vol. 43, no. 10, pp. 3792–3800, Oct. 2014. doi:10.1007/s11664-014-3165-7.
   Web of Science ®Google Scholar
• J. P. Gwinn and R. L. Webb, “Performance and testing of thermal interface materials,” Microelectronics J., vol. 34, no. 3, pp.215–222, 2003. DOI: 10.1016/S0026-2692(02)00191-X.
   Web of Science ®Google Scholar
• T.-M. Lee, K.-C. Chiou, F.-P. Tseng, and C.-C. Hung, “High thermal efficiency carbon nanotube-resin matrix for thermal interface materials,” in Proceedings Electronic Components and Technology, 2005. ECTC ’05., IEEE, 2005, pp. 55–59. doi: 10.1109/ECTC.2005.1441245.
   Google Scholar
• J. Hansson, T. M. J. Nilsson, L. Ye, and J. Liu. “Novel nanostructured thermal interface materials: a review”. Int. Mater. Rev., Vol. 63, no. 1, pp. 22–45, 2018, Taylor and Francis Ltd. DOI: 10.1080/09506608.2017.1301014.
   Web of Science ®Google Scholar
• F. Sarvar, D. Whalley, and P. Conway, “Thermal interface materials - a review of the state of the art,” in 2006 1st Electronic Systemintegration Technology Conference, IEEE, 2006, pp. 1292–1302. doi: 10.1109/ESTC.2006.280178.
   Google Scholar
• K. M. Razeeb, E. Dalton, G. L. W. Cross, and A. J. Robinson. “Present and future thermal interface materials for electronic devices”. Int. Mater. Rev., Vol. 63, no. 1, pp. 1–21, 2018, Taylor and Francis Ltd. DOI: 10.1080/09506608.2017.1296605.
   Web of Science ®Google Scholar
• M. C. K. Swamy and Satyanarayan, “A review of the performance and characterization of conventional and promising thermal interface materials for electronic package applications,” J. Electron. Mater., vol. 48, no. 12, pp. 7623–7634, Dec. 1, 2019. Springer New York LLC. DOI: 10.1007/s11664-019-07623-7.
   Web of Science ®Google Scholar
• S. Naghibi, et al. “Noncuring graphene thermal interface materials for advanced electronics,” Adv. Electron. Mater., vol. 6, no. 4, Apr. 2020. DOI: 10.1002/aelm.201901303.
   PubMed Web of Science ®Google Scholar
• Z. Zhang, X. Wang, and Y. Yan, “A review of the state-of-the-art in electronic cooling,” E-Prime - Adv. Electr. Eng. Electron. Energy, vol. 1, pp. 100009Jan. 1, 2021. Elsevier Ltd. 10.1016/j.prime.2021.100009.
   Google Scholar
• V. Talele, et al. “Battery thermal runaway preventive time delay strategy using different melting point phase change materials.” SAE Int. J. Electrified Veh., vol. 13, no. 3, 14–13–03–0017.Oct. 2023. DOI: 10.4271/14-13-03-0017.
   Google Scholar
• S. Gharbi, S. Harmand, and S. Ben Jabrallah, “Experimental comparison between different configurations of PCM based heat sinks for cooling electronic components,” Appl. Therm. Eng., vol. 87, pp. 454–462, Jun. 2015. DOI: 10.1016/j.applthermaleng.2015.05.024.
   Web of Science ®Google Scholar
• W. Hua, L. Zhang, and X. Zhang, “Research on passive cooling of electronic chips based on PCM: a review,” J. Mol. Liq., vol. 340, pp. 117183, Oct. 15, 2021. ElsevierB.V. 10.1016/j.molliq.2021.117183.
   Web of Science ®Google Scholar
• H. Fayaz, et al. “Investigation of numerical phase transition of nano-enhanced SiC/paraffin wax PCM in solar-assisted water desalination system,” Therm. Sci. Eng. Prog., vol. 50, pp. 102528, May. 2024. DOI:10.1016/j.tsep.2024.102528.
   Google Scholar
• A. M. A. Soliman, M. S. Yousef, S. Ookawara, and H. Hassan, “Experimental study of using system of flat heat pipe-phase change material inclusion heat sink for thermal regulation of simulated PV,” Exp. Heat Transfer, vol. 36, no. 5, pp.648–664, 2023. DOI: 10.1080/08916152.2022.2071359.
   Web of Science ®Google Scholar
• Q. Ren, P. Guo, and J. Zhu, “Thermal management of electronic devices using pin-fin based cascade microencapsulated PCM/expanded graphite composite,” Int. J. Heat Mass Transf., vol. 149, pp. 119199, Mar. 2020. DOI: 10.1016/j.ijheatmasstransfer.2019.119199.
   Web of Science ®Google Scholar
• H. Togun, et al. “A critical review on phase change materials (PCM) based heat exchanger: different hybrid techniques for the enhancement,” J. Energy. Storage., vol. 79, pp. 109840, Feb. 15, 2024. Elsevier Ltd. DOI: 10.1016/j.est.2023.109840.
   Web of Science ®Google Scholar
• Y. Wang, J. L. Alvarado, and W. Terrell, “Thermal performance of microencapsulated phase change material slurry in helical coils with reversed loops and wire coil inserts.” Exp. Heat Transfer, vol. 36, no. 7, pp. 984–1011, 2023. DOI: 10.1080/08916152.2022.2085822.
   Web of Science ®Google Scholar
• K. Z. Ahmed, M. Asif, and M. Faizan, “Design and development of a test method for the measurement of thermo-physical properties of different materials,” Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, 2023, doi: 10.1177/09544089231216028.
   Google Scholar
• S. Narumanchi, M. Mihalic, K. Kelly, and G. Eesley, “Thermal interface materials for power electronics applications,” in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, IEEE, May 2008, pp. 395–404. doi: 10.1109/ITHERM.2008.4544297.
   Google Scholar
• V. Singhal, P. J. Litke, A. F. Black, and S. V. Garimella, “An experimentally validated thermo-mechanical model for the prediction of thermal contact conductance,” Int. J. Heat Mass Transf., vol. 48, no. 25–26, pp.5446–5459, 2005. DOI: 10.1016/j.ijheatmasstransfer.2005.06.028.
   Web of Science ®Google Scholar
• K. A. Khan, A. H. Tarique, A. Chand, and A. Tariq, “A comparative study of thermal contact conductance for similar and dissimilar contact pairs using thermocouple and infrared thermography under vacuum and gaseous medium,” Int. J. Heat Mass Transf., vol. 222, pp. 125157, May 2024. DOI: 10.1016/j.ijheatmasstransfer.2023.125157.
   Web of Science ®Google Scholar
• M. Asif and A. Tariq, “Correlations of thermal contact conductance for nominally flat metallic contact in vacuum,” Exp. Heat Transfer, vol. 29, no. 4, pp. 456–484, Jul. 2016. DOI: 10.1080/08916152.2015.1024352.
   Web of Science ®Google Scholar
• J. Han, D. Kwon, B. Kim, J. Bae, and S. Jeong, “Investigation of thermal contact conductance of bare copper-copper and aluminum 1070-aluminum 1070 interfaces at low temperatures between 10 and 70 K,” Cryogenics (Guildf), vol. 133, pp. 103710, Jul. 2023. DOI: 10.1016/j.cryogenics.2023.103710.
   Web of Science ®Google Scholar
• Y. Ghajar, Afshin & Cengel, Heat and Mass Transfer - Fundamentals and Applications, 6th ed. New York, NY: McGraw-Hill Education, 2020.
   Google Scholar
• N. Wang, Y. Liu, S. Chen, L. Ye, and J. Liu, “Highly thermal conductive and electrically insulated graphene based thermal interface material with long-term reliability,” in Proceedings - Electronic Components and Technology Conference, Institute of Electrical and Electronics Engineers Inc., May 2019, pp. 1564–1568. doi: 10.1109/ECTC.2019.00240.
   Google Scholar
• M. Asif and A. Kumar, “Experimental study of thermal contact conductance for selected interstitial materials.” Lecture Notes in Mechanical Engineering, Springer Science and Business Media Deutschland GmbH, 2021, pp. 309–318. DOI: 10.1007/978-981-15-7831-1_28.
   Google Scholar
• Y. Chen, W. Luo, J. Wang, and J. Huang, “Enhanced thermal conductivity and durability of a paraffin wax nanocomposite based on carbon-coated aluminum nanoparticles,” J. Phys. Chem. C, vol. 121, no. 23, pp. 12603–12609, Jun. 2017. DOI: 10.1021/acs.jpcc.7b02651.
   Web of Science ®Google Scholar