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Abstract
A pulsed KrF excimer laser was used to remove several types of submicron-sized particles from silicon surfaces. Polystyrene latex particles, 0.1 μm and larger, were removed from silicon surfaces by dry laser cleaning (no water layer condensed on the surface) but SiO2 particles could not be so removed. However, during steam laser cleaning, in which a thin film of water is deposited on the surface as both an energy transfer medium and an adhesion force reduction agent, these 0.1–0.2 μm SiO2 particles were almost entirely removed. Calculations of the various forces contributing to adhesion indicate that hydrogen bonds are the major contributor to the adhesion of inorganic particles to substrate surfaces. Photoacoustic detection, using piezoelectric transducers, monitored the surface vibrations induced by the laser pulses.