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Articles

Effects of hygrothermal and thermal aging on the low-velocity impact properties of carbon fiber composites

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Pages 55-72 | Received 10 Jan 2019, Accepted 07 Jun 2019, Published online: 24 Jun 2019
 

Abstract

The effects of hygrothermal and thermal aging on the low-velocity impact properties of carbon fiber composites were systematically investigated by comparing the mass loss, morphologies, dynamic mechanical properties, and chemical structures of aged and non-aged specimens. The relationships between dent depth, damage area, residual compression strength, and impact energy were also discussed in detail. The obtained results showed that the non-aged composite featured good fiber-resin bonding, whereas hygrothermal and thermal aging led to fiber-matrix interface damage. For thermally aged samples, dent depth rapidly increased with impact energy above the inflection point, and the corresponding amplitude was greater than those observed for non-aged and hygrothermally aged specimens. Notably, hygrothermal and thermal aging did not affect the impact-induced damage morphology and the after-impact compression failure mode. At a constant impact energy, the damage area of thermally aged samples exceeded those of non-aged and hygrothermally aged ones; moreover, thermal aging exhibited greater influence on residual compressive strength than hygrothermal aging. Finally, whereas hygrothermal aging reduced the glass transition temperature (Tg) and did not induce the formation of new materials or the occurrence of chemical reactions, thermal aging resulted in increased Tg and was accompanied by the concomitant occurrence of oxidation reactions.

Disclosure statement

No potential conflict of interest was reported by the authors.

Additional information

Funding

This work was supported by the Foundation of Liaoning Province Education Administration [L201611]; the Shenyang Science and Technology Fund Project (Serial No. 18-013-0-25); the Key Laboratory of Fundamental Science for National Defense of Aeronautical Digital Manufacturing Process fund Project [SHSYS201802].

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