Effect of isothermal ageing on the microstructure, shear behaviour and hardness of the Sn58Bi/SnAgCuBiNi/Cu solder joints

Jian Changa School of Material Science and Engineering, Harbin University of Science and Technology, Harbin, China;b College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China

Yang Liub College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, ChinaCorrespondence[email protected]

https://orcid.org/0000-0002-4311-2198

Hao Zhangc Department of Microelectronics, Delft University of Technology, Delft, The Netherlands

Min Zhoub College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China

Xue Yuxiongb College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China

Xianghua Zengb College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China

Rongxing Caob College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China

Penghui Chenb College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China

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ABSTRACT

The microstructure, shear behaviour and hardness of the SnBi/SACBN/Cu solder joint before and after isothermal ageing were investigated in comparison with the SnBi/Cu and SACBN/Cu solder joints. The experimental results indicated that the pre-soldered SACBN joint had a significant effect on the formation and growth of the β-Sn grains in the SnBi bulk solder. The brittleness of the SnBi/SACBN/Cu composite solder joint was also suppressed and its failure mode transformed from brittle failure to brittle-ductile failure after reflow. However, the shear strength and failure mode of the SnBi/SACBN/Cu composite solder joint became similar to those of the SnBi/Cu joints after 600 h isothermal ageing. The shear strength of the three kinds of solder joints decreased after isothermal ageing, but the SnBi/SACBN/Cu composite solder joint showed higher shear strength than SnBi/Cu did during ageing. The shear strength of the composite solder joint was 67.1MPa after ageing. Due to the diffusion of elements in the isothermal ageing process, the microstructure of the composite solder joint was significantly coarsened after ageing for 600 hours. This phenomenon further led to the decrease of the hardness and shear strength of the three kinds of solder joints.

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Effect of isothermal ageing on the microstructure, shear behaviour and hardness of the Sn58Bi/SnAgCuBiNi/Cu solder joints

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Effect of isothermal ageing on the microstructure, shear behaviour and hardness of the Sn58Bi/SnAgCuBiNi/Cu solder joints

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