References
- Yang L, Zhou W, Ma Y, et al. Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging. Mater Sci Eng A. 2016;667:368–375.
- Lai Z, Ye D. Microstructure and fracture behavior of non eutectic Sn-Bi solder alloys. J Mater Sci Mater Electron. 2016;27:3182–3192.
- Ye D, Du C, Wu M, et al. Microstructure and mechanical properties of Sn–xBi solder alloy. J Mater Sci Mater Electron. 2015;26:3629–3637.
- Lai Z, Ye D. Microstructure and properties of Sn-10Bi-xCu solder alloy/joint. J Electron Mater. 2016;45:3702–3711.
- Cheng J, Hu X, Li Q, et al. Influences of Ni addition into Cu-x Ni alloy on the microstructure evolution and mechanical property of Sn-58Bi/Cu-x Ni solder joint. Appl Phys A. 2020;126:1–10.
- Zhou S, Yang C, Lin S, et al. Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy. Mater Sci Eng A. 2019;744:560–569.
- Sun H, Chan YC, Wu F. The impact of reflow soldering induced dopant redistribution on the mechanical properties of CNTs doped Sn58Bi solder joints. J Mater Sci Mater El. 2015;29:5318–5325.
- Ma D, Wu P. Effects of Zn addition on mechanical properties of eutectic Sn–58Bi solder during liquid-state aging. Nonferrous Met Soc. 2015;25:1225–1233. .
- Zhu W, Ma Y, Li X, et al. Effects of Al2O3 nanoparticles and properties of Sn58Bi solder alloys. J Mater Sci Mater El. 2018;29:7575–7585.
- Shen J, Pu Y, YIN H, et al. Effects of Cu, Zn On the wettability and shear mechanical properties of Sn-Bi-based lead-free solders. J Electron Mater. 2015;44:532–541.
- Lee SM, Yoon JW, Jung SB. Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions. J Mater Sci Mater El. 2015;26:1649–1660.
- Myung WR, Kim Y, Jung SB. Evaluation of the bondability of the epoxy-enhanced Sn-58Bi solder with ENIG and ENEPIG surface finishes. J Electron Mater. 2015;44:4637–4645.
- Kim J, Myung WR, Jung SB. Effects of aging treatment on mechanical properties of Sn-58Bi epoxy solder on ENEPIG-surface-finished PCB. J Electron Mater. 2016;45:5895–5903.
- Zhang X, Hu X, Jiang X, et al. Effect of Ni addition to the Cu substrate on the interfacial reaction and IMC growth with Sn3.0Ag0.5Cu solder. Appl Phys A. 2018;124:315.
- Hu FQ, Zhang QK, Jiang JJ, et al. Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction. Mater Lett. 2018;214:142–145.
- Zou HF, Zhang QK, Zhang ZF. Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate. Mater Sci Eng A. 2012;532:167–177.
- Wang F, Li D, Zhang Z, et al. Improvement on interfacial structure and properties of Sn-58Bi/Cu joint using Sn-3.0Ag-0.5Cu solder as barrier. J Mater Sci Mater El. 2017;28:19051–19060.
- Xu R, Liu Y, Zhang H, et al. Evolution of the microstructure of Sn58Bi solder paste with Sn-3.0Ag-0.5Cu addition during isothermal aging. J Electron Mater. 2019;48:1758–1765.
- Pang XY, Shang PJ, Wang SQ, et al. Weakening of the Cu/Cu3Sn(100)Interface by Bi impurities. J Electron Mater. 2010;39:1277–1278.
- Maio D, Hunt C. Time-lapse photography of the β-Sn/α-Sn allotropic transformation. J Mater Sci Mater El. 2009;20:386–391.