Abstract
We have developed the single ferroelectric field-effect-transistor technology using a ferroelectric SBT(SrBi2Ta2O9) and NO(Si3N4/SiO2) materials which were compatible with the standard Si CMOS process. The SBT/NO combined layer was used as a gate dielectric layer of MFISFET device. A small-sized MFISFET having 10/3um-width/length of gate was fabricated. The memory window of n-channel and p-channel MFISFET are all about 2.0 V. The threshold voltages of n-channel and p-channel MFISFET are about 1.8V and-2.1 V. The current difference between the ION(on current) and IOFF(off current) for sensing margin is more than 100 times in ID-VG hysteresis curve. The retention property of MFISFET is examined by reading drain current after writing to the gate. The drain current as a function of retention time of MFISFET using NO layer remains almost the same value of its initial value over 104 seconds at room temperature.
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