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Abstract
Hard and brittle materials have the characteristics of high hardness and brittleness, wear resistance and good chemical stability. They are widely used in aerospace, mining, metallurgy, information, military and other fields. However, its cutting performance is very poor, which is known as a typical difficult to machine material. In particular, semiconductor materials such as ceramics put forward higher requirements for processing efficiency, processing quality and sawing loss. Diamond wire saw machining technology has the characteristics of high processing efficiency, small crack damage, low sawing loss and green environmental protection. It is widely used in the machining of hard and brittle materials. This paper summarizes the history and current situation, cutting mechanism and cutting technology of diamond wire saw machining hard and brittle materials, and puts forward relevant solutions for the problems existing in diamond wire saw machining hard and brittle materials, which has theoretical reference value and practical significance for the further research of diamond wire saw machining hard and brittle materials.