Thermodynamic description of the viscosity of liquid solder alloys with minor Co impurities

ABSTRACT

Because of the increasing complexity and cost of experiments carried out, the data for the multi-component alloy systems have frequently been obtained by numerical modelling. It is clear that the related calculations require reliable data dealing with the pure components and binary alloy systems. Selecting the reliable data concerning the pure components from the literature, the viscosities for the SAC and (SAC)_1−x Co_x solder alloys have been calculated using different viscosity models (geometric and physical). The viscosity decreases as the amount of tin content increases in the SAC387 alloy while the addition of the cobalt to SAC387 solder results in the increasing of the viscosity. Moreover, by computing the root mean square values between theoretical and experimental viscosities, it can be concluded that the lowest value among all models is that of obtained by Kaptay equation.

KEYWORDS:

• Dynamic viscosity
• geometric models
• physical models
• multi-component alloys
• pb-free ternary SAC and Quaternary (SAC)_1−x co_x solder alloys

Disclosure statement

No potential conflict of interest was reported by the authors.

ORCID

Hüseyin Arslan http://orcid.org/0000-0003-1509-7725