Texture transition in Al–Mg alloys: effect of magnesium

ABSTRACT

The evolution of deformation texture and microstructure in commercially pure Al (cp-Al) and two Al–Mg alloys (Al–4Mg and Al–6Mg) during cold rolling to a very large strain (true strain ε_t≈ 3.9) was investigated. The development of deformation texture in cp-Al, after rolling, can be considered as pure metal or Copper-type, which is characterised mainly by the presence of Cu {112}<111>, Bs {110}<112> and S {123}<634> components. The deformation microstructure clearly indicates that deformation mechanism in this case remains slip dominated throughout the deformation range. In the Al–4Mg alloy, the initial slip mode of deformation is finally taken over by mechanism involving both slip and Copper-type shear bands, at higher deformation levels. In contrast, in the Al–6Mg alloy, the slip and twin mode of deformation in the initial stage is replaced by slip and Brass-type shear bands at higher deformation levels. Although a Copper-type deformation texture forms in the two Al–Mg alloys at the initial stage of deformation, there is a significant increase in the intensity of the Bs component and a noticeable decrease in the intensity of the Cu component at higher levels of deformation, particularly in the Al–6Mg alloy. This phenomenon indicates the possibility of transition of the deformation texture from Cu-type to Bs-type, which is concurrent with the addition of Mg. Using visco-plastic self-consistent modelling, the evolution of deformation texture could be simulated for all three materials.

KEYWORDS:

• Texture
• microstructure
• slip
• partial slip
• twinning
• shear bands

Acknowledgements

We would like to thank Drs. Carlos Tome and Ricardo Lebensohn, Los Alamos National Laboratory, USA for providing the VPSC version 7b code. The extensive use of microscopes at the Advanced Facility of Microscopy and Microanalysis (AFMM) facility and XRD at the Institute X-ray facility, Indian Institute of Science (IISc), Bangalore is acknowledged.

Disclosure statement

No potential conflict of interest was reported by the author(s).