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Abstract
Defect-free joints of TiAl/Ti6242 have been produced by TLP bonding using Ti, Cu foils as insert metals. The influence of the bonding parameters such as bonding pressure, bonding temperature, dwell time and the stacking sequence of the parent materials on the microstructure of the joined zone has been investigated. The results showed that bonding pressure played an important role even though there was a liquid phase during bonding. The stacking sequence of the parent materials also had a major effect on joint formation. Elimination of defects at the interface of the TiAl/ interlayer in order to obtain sound joints was a major problem. Similar interface structures were observed in all cases except that the thickness of the joined zone was different. The results of the study revealed that the surface oxide layer on TiAl had a major effect on the interface diffusion process. Based on the interface diffusion and interface structure, the joint formation process has been investigated and a mechanism for the effect of experimental parameters on joint formation has been proposed.