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Science and Technology of Welding and Joining Volume 9, 2004 - Issue 6
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Articles

Transient liquid phase (TLP) bonding of TiAl/Ti6242 with Ti–Cu foil

H. Duan
,
M. Koçak
,
K.-H. Bohm
&
V. Ventzke
Pages 525-531 | Published online: 04 Dec 2013

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