Non‐destructive evaluation of shoes bonded area defect applying ultrasound infrared thermography technique and finite element analysis

Abstract

The infrared (IR) thermography technique is being applied in many areas. Particularly these days, non‐destructive inspection and evaluation using the ultrasound IR thermography technique are the focus in a wide range of study areas. The ultrasound IR thermography technique uses the principle that ultrasound waves projected to objects with cracks or defects at connections generate local heat from the defective surface. The most important cause of defects in shoes is the decrease in strength due to delamination in bonding. The most serious defect is the bonding defect between the outer cover and the sole of shoes, which was determined only now through visual inspection. In this research, non‐destructive evaluation method is introduced for total inspection of special shoes applying ultrasound IR thermography technique. Performance of the proposed method is shown by thermo‐imaging and confirmed through finite element analysis of COMSOL Multiphysic. The total inspection system using IR thermal camera for special shoes, its applicability, and system configuration are introduced.

Keywords:

• Ultrasound infrared thermography
• Delamination
• Shoes bonded area
• NDE
• Non‐destructive evaluation
• COMSOL Multiphysic

This work was supported by the Korea Research Foundation grant funded by the Korean Government (MEST) (grant no. 2009‐0075231).