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Original Article

Non‐destructive evaluation of shoes bonded area defect applying ultrasound infrared thermography technique and finite element analysis

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Pages s408-s411 | Received 20 Sep 2010, Accepted 15 Nov 2010, Published online: 12 Nov 2013

References

  • Mignogna RB, Green RE, Duke JC, Henneke ІІ EG, Reifsnider KL:‘Thermographic investigation of high‐power ultrasonic heating in materials’, Ultrasonic, 1981, 19, 159–163
  • Favro LD, Thomas RL, Han X, Ouyang Z, Newaz G, Gentile D:‘Sonic infrared imaging of fatigue cracks’, Int. J. Fatig, 2001, 23, 5471–5476
  • Favro LD, Han X, Ouyang Z, Sun G, Sui H, Thomas RL:‘Infrared imaging of defects heated by a sonic pulse’, Rev. Sci. Instrum, 2000, 71, 2418–2421
  • Han X, Favro LD, Thomas RL: ‘Recent developments in sonic IR imaging,’ Rev. Quant. Nondestr. Eval., 2003, 22, 500–504
  • Yang DY, Kim CH, Kim JY: in ‘Modern physics’, Vol. 8; 2003, Zurich, Trans Tech Publications.

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