Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging

K K Zhang School of Materials Science and EngineeringHenan University of Science and Technology, Luoyang471003, China; Henan Key Laboratory of Science and Processing Technology of Non-ferrous MetalsHenan University of Science and Technology, Luoyang471003, ChinaCorrespondence[email protected]

C Y Li School of Materials Science and EngineeringHenan University of Science and Technology, Luoyang471003, China

R F Qiu School of Materials Science and EngineeringHenan University of Science and Technology, Luoyang471003, China; Henan Key Laboratory of Science and Processing Technology of Non-ferrous MetalsHenan University of Science and Technology, Luoyang471003, China

H X Shi School of Materials Science and EngineeringHenan University of Science and Technology, Luoyang471003, China; Henan Key Laboratory of Science and Processing Technology of Non-ferrous MetalsHenan University of Science and Technology, Luoyang471003, China

Y L Wang School of Materials Science and EngineeringHenan University of Science and Technology, Luoyang471003, China; Henan Key Laboratory of Science and Processing Technology of Non-ferrous MetalsHenan University of Science and Technology, Luoyang471003, China

Abstract

Aging treatment was implemented for the Sn2·5Ag0·7Cu0·1RExNi/Cu solder joint under various temperatures simulating the service environment. The growing behaviour of the intermetallic compound at the soldering interface during aging was investigated. In the case of adding 0·1%Ni aged solder joint, the maximum growth activation energies of (Cu,Ni)₆Sn₅ and Cu₃Sn are 86·8 and 93·7 kJ mol⁻¹ respectively. The results reveal that the growth of intermetallic compound in the soldering interface can be suppressed, and the solder joint can be strengthened by adding proper quantities of Ni in the solder.

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The present work was supported by the Foundation of Henan Province Outstanding Youth Scientist (grant no. 074100510011) and the Natural Science Foundation of China (grant no. 50774029).

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Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging

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Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging

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