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Materials Science and Technology Volume 28, 2012 - Issue 6
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Original Article

Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging

K K Zhang School of Materials Science and EngineeringHenan University of Science and Technology, Luoyang471003, China; Henan Key Laboratory of Science and Processing Technology of Non-ferrous MetalsHenan University of Science and Technology, Luoyang471003, ChinaCorrespondence[email protected]
,
C Y Li School of Materials Science and EngineeringHenan University of Science and Technology, Luoyang471003, China
,
R F Qiu School of Materials Science and EngineeringHenan University of Science and Technology, Luoyang471003, China; Henan Key Laboratory of Science and Processing Technology of Non-ferrous MetalsHenan University of Science and Technology, Luoyang471003, China
,
H X Shi School of Materials Science and EngineeringHenan University of Science and Technology, Luoyang471003, China; Henan Key Laboratory of Science and Processing Technology of Non-ferrous MetalsHenan University of Science and Technology, Luoyang471003, China
&
Y L Wang School of Materials Science and EngineeringHenan University of Science and Technology, Luoyang471003, China; Henan Key Laboratory of Science and Processing Technology of Non-ferrous MetalsHenan University of Science and Technology, Luoyang471003, China
Pages 760-765 | Received 30 Nov 2011, Accepted 29 Dec 2011, Published online: 12 Nov 2013

References

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