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Transactions of the IMF
The International Journal of Surface Engineering and Coatings
Volume 48, 1970 - Issue 1
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Original Articles

The Nucleation and Growth of Electroless Metal Deposited onto Plastic Substrates

A. RantellPolytechnic of the South Bank, London, SE1
Pages 191-198 | Received 17 Aug 1970, Published online: 09 May 2017

Citations (15)

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Read on this site (4)

R. G. Wedel. (1977) Durability and structure of electroplated plastics. International Metals Reviews 22:1, pages 97-118.
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A. Rantell & A. Holtzman. (1974) The Role of Accelerators Prior to Electroless Plating of ABS Plastic. Transactions of the IMF 52:1, pages 31-38.
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Ismat A. Abu-Isa. (1973) Metal Plating of Polymeric Surfaces. Polymer-Plastics Technology and Engineering 2:1, pages 29-65.
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A. Rantell & A. Holtzman. (1973) Mechanism of Activation of Polymer Surfaces by Mixed Stannous Chloride/Palladium Chloride Catalysts. Transactions of the IMF 51:1, pages 62-68.
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Articles from other publishers (11)

Mario Bragaglia, Vincenzo Pascale, Marianna Rinaldi & Francesca Nanni. (2022) Silver electroless plating on 3D printed resins via stereolithography: A sustainable solution. Thin Solid Films 757, pages 139417.
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Daniel R. Merkel, Christopher M. Laursen, Christopher M. Yakacki, Ronald A. Rorrer & Carl P. Frick. (2017) Characterization and mechanical testing of polydopamine-adhered electroless copper films. Surface and Coatings Technology 331, pages 211-220.
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Milan Paunovic. 2010. Modern Electroplating. Modern Electroplating 433 446 .
W.J. Cheong, Ben L. Luan & David W. Shoesmith. (2004) The effects of stabilizers on the bath stability of electroless Ni deposition and the deposit. Applied Surface Science 229:1-4, pages 282-300.
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A. Szasz, D.J. Fabian, Z. Paal & J. Kojnok. (1988) Chemical mechanisms in electroless deposition. Journal of Non-Crystalline Solids 103:1, pages 21-27.
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V. S. Demidenko, A. Szász, M. A. Aysawi & V. D. Kuznetsov. (2006) On the model calculation of the excitonic‐like states and their possible role in autocatalytic processes. I. Application to the formation of autocatalytic NiP Amorphous Coatings. physica status solidi (b) 140:1, pages 121-126.
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J.K. DENNIS & T.E. SUCH. 1986. Nickel and Chromium Plating. Nickel and Chromium Plating 286 314 .
S. Nakahara & Y. Okinaka. (1983) Microstructure and ductility of electroless copper deposits. Acta Metallurgica 31:5, pages 713-724.
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D. J. Lax & P. A. Maughan. (1979) The electrochemical characteristics of a methanol stabilized electroless copper-plating solution. Journal of Applied Electrochemistry 9:3, pages 337-341.
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A. Rantell & A. Holtzman. (1976) Metallising of Circuit Boards Using Mixed SnCl2 / PdCl2 Catalysts. Circuit World 2:2, pages 30-36.
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T. L. Aycock, N. C. Huie & George Krauss. (1974) The effects of stabilizing additives on the microstructure and properties of electroless copper deposits. Metallurgical transactions 5:5, pages 1215-1223.
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