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International Journal of Electronics Volume 104, 2017 - Issue 7
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Original Articles

Emerging interconnects: a state-of-the-art review and emerging solutions

S. M. TurkaneMatoshri College of Engineering & Research Centre, Nashik, Savitribai Phule Pune University, Maharashtra, India;Pravara Rural Engineering College, Ahmednagar, Savitribai Phule Pune University, Maharashtra, 413 736, IndiaCorrespondence[email protected]
&
A. K. KureshiVishwabharti Academy’s College of Engineering, Ahmednagar, Savitribai Phule Pune University, Maharashtra, 414201, India
Pages 1107-1119 | Received 14 Jan 2016, Accepted 02 Jan 2017, Published online: 01 Mar 2017

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Vijay Rao Kumbhare, Punya Prasanna Paltani & Manoj Kumar Majumder. (2021) Relative stability of shielded top- and side-contact MLGNR interconnects. International Journal of Electronics Letters 9:4, pages 447-458.
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Articles from other publishers (7)

Maryam Sadat Hosseini Omshi, Reza Faghih Mirzaee, Akram Reza & Mohammad Mirzaei. (2024) Low-Power Bus Encoding by Ternary LWC and Quaternary Transition Signaling: From Initial Concept to Circuit Design. IEEE Transactions on Very Large Scale Integration (VLSI) Systems 32:4, pages 682-694.
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Xu Wang, Weiwu Ma & Carlos Fernandez. (2023) Design and Achievement of Superfilling Electroless Silver Deposition for Micrometer Trenches. Surface Engineering and Applied Electrochemistry 59:1, pages 15-19.
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Quanlin Yu & Zhongliang Pan. (2022) Investigation on Bandwidth Enhancement in Copper—Carbon Nanotube Composite Interconnects. Investigation on Bandwidth Enhancement in Copper—Carbon Nanotube Composite Interconnects.
Tirth Patel, Nishtha Diwanji, Michika Gayari, Himadri Patel, Kinjal Patel & Rutu Parekh. 2022. Sustainable Technology and Advanced Computing in Electrical Engineering. Sustainable Technology and Advanced Computing in Electrical Engineering 1099 1115 .
Vijay Rao Kumbhare, Punya Prasanna Paltani & Manoi Kumar Maiumder. (2018) Future of Graphene based Interconnecte Technology - A Reality or a Distant Dream. Future of Graphene based Interconnecte Technology - A Reality or a Distant Dream.
Xin Jin, Kuanchen Xiong, Roderick Marstell, Nicholas C. Strandwitz, James C. M. Hwang, Marco Farina, Alexander Göritz, Matthias Wietstruck & Mehmet Kaynak. (2018) Scanning microwave microscopy of buried CMOS interconnect lines with nanometer resolution. International Journal of Microwave and Wireless Technologies 10:5-6, pages 556-561.
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Fu Zhao, Yin Xu, Milton Tumelero, Silvia Pelegrini, Andre Pasa & Giovanni Zangari. (2018) Electrical Conductivity in Electrodeposited Cu-Ge(O) Alloy Films. Journal of The Electrochemical Society 165:13, pages D628-D634.
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