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Original Articles

Differences of the microstructural evolution of Cu powder during continuous and interrupted mechanical milling

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Pages 232-239 | Received 09 Nov 2016, Accepted 23 Dec 2016, Published online: 26 Jan 2017

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A. Sadoun, A. Ibrahim & A.W. Abdallah. (2020) Fabrication and evaluation of tribological properties of Al2O3 coated Ag reinforced copper matrix nanocomposite by mechanical alloying. Journal of Asian Ceramic Societies 8:4, pages 1228-1238.
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Articles from other publishers (8)

Ayman M. Sadoun, Ismail R. Najjar, Ghazi S. Alsoruji, M. S. Abd-Elwahed, Mohamed Abd Elaziz & Adel Fathy. (2022) Utilization of Improved Machine Learning Method Based on Artificial Hummingbird Algorithm to Predict the Tribological Behavior of Cu-Al2O3 Nanocomposites Synthesized by In Situ Method. Mathematics 10:8, pages 1266.
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A.M. Sadoun, A.F. Meselhy & A.W. Abdallah. (2021) Microstructural, mechanical and wear behavior of electroless assisted silver coated Al2O3–Cu nanocomposites. Materials Chemistry and Physics 266, pages 124562.
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M.S. Abd-Elwahed, A.M. Sadoun & M. Elmahdy. (2020) Electroless-plating of Ag nanoparticles on Al2O3 for enhanced mechanical and wear properties of Cu–Al2O3 nanocomposites. Journal of Materials Research and Technology 9:6, pages 13749-13758.
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Onur Güler, Temel Varol, Ümit Alver & Aykut Canakci. (2020) Effect of Al2O3 content and milling time on the properties of silver coated Cu matrix composites fabricated by electroless plating and hot pressing. Materials Today Communications 24, pages 101153.
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Massimo Pellizzari & Giulia Cipolloni. (2020) Spark Plasma Sintering of Copper Matrix Composites Reinforced with TiB2 Particles. Materials 13:11, pages 2602.
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A. Mohamed & A. Ibrahim. (2020) WITHDRAWN: Microstructure and tribological properties of alumina coating reinforced copper matrix nanocomposite. Ceramics International.
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Onur Güler, Temel Varol, Ümit Alver & Aykut Çanakçı. (2019) The effect of flake-like morphology on the coating properties of silver coated copper particles fabricated by electroless plating. Journal of Alloys and Compounds 782, pages 679-688.
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Yitzchak Rosen, Roy Marrach, Vitaly Gutkin & Shlomo Magdassi. (2019) Thin Copper Flakes for Conductive Inks Prepared by Decomposition of Copper Formate and Ultrafine Wet Milling. Advanced Materials Technologies 4:1, pages 1800426.
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