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Heat Transfer Engineering Volume 43, 2022 - Issue 3-5: Selected Papers from the 12th International Conference on Computational Heat and Mass Transfer (ICCHMT2019), September 03-06, 2019, Rome, Italy
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Articles

Experimental and Numerical Investigation on Flow Boiling in a Small Semi-circular Channel of Plate Once-Through Steam Generator

Xiaofei Yuana Institute of Thermal Engineering, School of Mechanical, Electronic and Control Engineering, Beijing Jiaotong University, Beijing, China;b Beijing Key Laboratory of Flow and Heat Transfer of Phase Changing in Micro and Small Scale, Beijing Jiaotong University, Beijing, ChinaView further author information
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Lixin Yanga Institute of Thermal Engineering, School of Mechanical, Electronic and Control Engineering, Beijing Jiaotong University, Beijing, China;b Beijing Key Laboratory of Flow and Heat Transfer of Phase Changing in Micro and Small Scale, Beijing Jiaotong University, Beijing, ChinaCorrespondence[email protected]
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Zemin Shanga Institute of Thermal Engineering, School of Mechanical, Electronic and Control Engineering, Beijing Jiaotong University, Beijing, China;b Beijing Key Laboratory of Flow and Heat Transfer of Phase Changing in Micro and Small Scale, Beijing Jiaotong University, Beijing, ChinaView further author information
Pages 208-222 | Published online: 19 Jan 2021

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Armin Beitollahi, Amirmohammad Sattari, Pedram Hanafizadeh & Mehdi Ashjaee. Prediction of subcooled flow boiling local heat transfer coefficient in microchannel heatsinks. Heat Transfer Engineering 0:0, pages 1-19.
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Articles from other publishers (2)

Gyogeun Youn, Wanjae Jang, Youngjae Jeon, Kang-Heon Lee, Gyu Mahn Lee, Jae-Seon Lee & Seongmin Chang. (2023) Structural integrity assessment procedure of PCSG unit block using homogenization method. Nuclear Engineering and Technology 55:4, pages 1365-1381.
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Jin Su Kwon, Doh Hyeon Kim, Sung Gil Shin, Jeong Ik Lee & Sang Ji Kim. (2022) Assessment of thermal fatigue induced by dryout front oscillation in printed circuit steam generator. Nuclear Engineering and Technology 54:3, pages 1085-1097.
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