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Numerical Heat Transfer, Part A: Applications
An International Journal of Computation and Methodology
Volume 69, 2016 - Issue 3
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Original Articles

Finite volume-based simulation of the wave soldering process: Influence of the conveyor angle on pin-through-hole capillary flow

M. S. Abdul AzizSchool of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal, Penang, MalaysiaCorrespondence[email protected]
,
M. Z. AbdullahSchool of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal, Penang, Malaysia
,
C. Y. KhorSchool of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal, Penang, Malaysia
,
A. JalarInstitute of Microengineering and Nanoelectronics, University Kebangsaan Malaysia, Bangi, Selangor, Malaysia
,
F. Che AniCelestica Sdn. (M) Bhd., Industrial Technology Park, Kulim, Kedah, Malaysia
,
Nobe. yanShenzhen Kunqi Xinhua Technology Co., Ltd, Gangtou, Bantian, Longgang, Shenzhen, Guangdong, China
&
C. CheokCyntac Pte. Ltd., Singapore
 show all
Pages 295-310 | Received 17 Jun 2014, Accepted 15 May 2015, Published online: 30 Nov 2015

Citations (12)

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Read on this site (2)

Mark Selvan, Mohd Sharizal Abdul Aziz, Kok Hwa Yu, M. S. Nurulakmal, H. P. Ong, Chu Yee Khor & Wan Rahiman. (2023) A study on the effect of the number of fin valleys on the thermal performance of a bus duct conductor. Numerical Heat Transfer, Part A: Applications 84:7, pages 781-800.
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Mark Selvan, Mohd Sharizal Abdul Aziz, M. S. Nurulakmal, H. P. Ong & C. Y. Khor. (2023) Numerical study on the effect of fin length variation on the thermal performance of a bus duct conductor. Numerical Heat Transfer, Part A: Applications 83:2, pages 116-133.
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Articles from other publishers (10)

Jing Rou Lee, Mun Xi Chong, Mohd Sharizal Abdul Aziz, Chu Yee Khor, Mohd Arif Anuar Mohd Salleh, Mohd Remy Rozainy Mohd Arif Zainol & F. Che Ani. (2023) Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material. Journal of Electronic Materials.
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Mark Selvan, Mohd Sharizal Abdul Aziz, Kok Hwa Yu, M.S. Nurulakmal, H.P. Ong & C.Y. Khor. (2023) A study on the effect of fin pitch variation on the thermal performance of a bus duct conductor. International Journal of Thermal Sciences 184, pages 107938.
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Reinhardt Seidel, Ben Rachinger, Nils Thielen, Konstantin Schmidt, Sven Meier & Jörg Franke. (2023) Development and validation of a digital twin framework for SMT manufacturing. Computers in Industry 145, pages 103831.
Crossref
A. A. A. Jaludin, Mohd Sharizal Abdul Aziz, Goh Wei Shing, M. H. H. Ishak, Mohd Syakirin Rusdi & M. I. Ahmad. 2023. Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium. Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium 73 81 .
Jing Rou Lee, Mohd Sharizal Abdul Aziz, Muhammad Faiz Ridhwan Rosli, Mohd Syakirin Rusdi, Roslan Kamaruddin, M. H. H. Ishak & Mohd Arif Anuar Mohd Salleh. 2023. Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium. Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium 83 91 .
Jing Rou Lee, Mohd Sharizal Abdul Aziz, Mohd Arif Anuar Mohd Salleh, Chu Yee Khor & Mohammad Hafifi Hafiz Ishak. 2023. TMS 2023 152nd Annual Meeting & Exhibition Supplemental Proceedings. TMS 2023 152nd Annual Meeting & Exhibition Supplemental Proceedings 909 920 .
Mark Selvan, Mohd Sharizal Abdul Aziz, Mohd Arif Anuar Mohd Salleh, Nurulakmal Mohd Sharif, Chu Yee Khor, Heng Pin Ong, Mohd Remy Rozaini Mohd Arif Zainol, Petrica Vizureanu, Diana-Petronela Burduhos-Nergis & Andrei Victor Sandu. (2022) Influence of Fin Thickness on the Thermal Performance and Selection of Coating Method for a Bus Duct Conductor. Coatings 13:1, pages 12.
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Zuraihana Bachok, Mohamad Aizat Abas, Muhammad Zaim Hanif Nazarudin, Saifulmajdy A. Zahiri, Mohamad Fikri Mohd Sharif & Fakhrozi Che Ani. (2022) Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation. Journal of Electronic Packaging 144:4.
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Jing Rou Lee, Mohd Sharizal Abdul Aziz, Mohammad Hafifi Hafiz Ishak & Chu Yee Khor. (2022) A review on numerical approach of reflow soldering process for copper pillar technology. The International Journal of Advanced Manufacturing Technology 121:7-8, pages 4325-4353.
Crossref
Reinhardt Seidel, Marcel Sippel & Jorg Franke. (2022) 2-D Fluid Simulation Approach for Miniwave Soldering. 2-D Fluid Simulation Approach for Miniwave Soldering.

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