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Materials and Manufacturing Processes Volume 21, 2006 - Issue 8
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ARTICLES

Modeling the Etching Rate and Uniformity of Plasma-Aided Manufacturing Using Statistical Experimental Design

K. C. Yung Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Hong KongCorrespondence[email protected]
,
J. Wang Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Hong Kong
,
S. Q. Huang Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Hong Kong
,
C. P. Lee Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Hong Kong
&
T. M. Yue Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Hong Kong
Pages 899-906 | Received 03 Feb 2006, Accepted 19 May 2006, Published online: 15 Mar 2007

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Chil-Chyuan Kuo & Ying-Jie Wang. (2014) Development of a Micro-Hot-Embossing Mold with High Replication Fidelity Using Surface Modification. Materials and Manufacturing Processes 29:9, pages 1101-1110.
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Chil-Chyuan Kuo & Hsin-You Liao. (2014) Enhancing the Mechanical Properties of Epoxy Resin Mold by Adding Zirconia Particles. Materials and Manufacturing Processes 29:7, pages 840-847.
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Chil-Chyuan Kuo & Hsiu-Ju Hsu. (2013) Development and Application of Hybrid Mold with Microfeatures in Micro-Hot Embossing. Materials and Manufacturing Processes 28:11, pages 1203-1208.
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Chil-Chyuan Kuo & Hsiu-Ju Hsu. (2013) Micro-Hot Embossing of Fresnel Lens Using Precision Micro-Featured Mold. Materials and Manufacturing Processes 28:11, pages 1228-1233.
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Chun-Jen Weng. (2011) Feasibility Study of Process Integration for High Aspect Ratio Hard-Mask Scheme Technologies of Low-k/Cu Interconnect Fabrication. Materials and Manufacturing Processes 26:9, pages 1104-1110.
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K. C. Yung, H. Liem, H. S. Choy, H. F. Zheng & T. M. Yue. (2010) Multiresponse Optimization of Surface Plasma Treatment Using Taguchi Method. Materials and Manufacturing Processes 25:9, pages 1001-1011.
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Articles from other publishers (11)

Chanjuan Liu, Jiuru Gao, Zhiwei He, Kang Han, Zhen Yang, Kaidong Xu & Shiwei Zhuang. (2024) Mechanisms underlying temperature uniformity in electrostatic chucks through experimental and simulation methods. Applied Thermal Engineering 238, pages 122011.
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Heping Chen & John Leclair. (2021) Optimizing Process Recipe for Critical Dimensions in Dry Etching Process. IEEE Transactions on Semiconductor Manufacturing 34:1, pages 87-93.
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Chil-Chyuan Kuo & Shin-Yun Lyu. (2017) A cost-effective approach using recycled materials to fabricate micro-hot embossing dies for microfabrication. The International Journal of Advanced Manufacturing Technology 94:9-12, pages 4365-4371.
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Chil-Chyuan Kuo & Shin-Yun Lyu. (2016) Development of low-cost hot embossing stamps with long life span and environmental protection. The International Journal of Advanced Manufacturing Technology 91:5-8, pages 1889-1895.
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Chil-Chyuan Kuo & Bing-Cheng Chen. (2016) Development of hot embossing stamps with conformal cooling channels for microreplication. The International Journal of Advanced Manufacturing Technology 88:9-12, pages 2603-2608.
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C.-C. Kuo & B.-C. Zhuang. (2016) Manufacturing process development of a precision rapid tooling with high-aspect-ratio micro-sized features. Materialwissenschaft und Werkstofftechnik 47:1, pages 29-36.
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A. Luque, G. Flores, F. Perdigones, D. Medina, J. García & J.M. Quero. (2013) Single axis accelerometer fabricated using printed circuit board techniques and laser ablation. Sensors and Actuators A: Physical 192, pages 119-123.
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A. Luque, G. Flores, F. Perdigones, D. Medina, J. Garcia & J. M. Quero. (2011) Combination of PCBMEMS and laser ablation to construct inexpensive accelerometers. Combination of PCBMEMS and laser ablation to construct inexpensive accelerometers.
K. C. Yung, H. Liem, H. S. Choy & T. M. Yue. (2009) Impact of plasma etching on fabrication technology of liquid crystal polymer printed circuit board. Journal of Materials Science: Materials in Electronics 21:9, pages 954-962.
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K. C. Yung, H. Liem, H. Choy & T. M. Yue. (2010) A study of critical processing technologies of liquid crystal polymer printed circuit board for high speed application. Journal of Applied Polymer Science 116:4, pages 2348-2358.
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K. C. Yung, H. M. Liem, H. S. Choy, H. F. Zheng, Tao Feng & T. M. Yue. (2009) The effect of plasma etching process on rigid flex substrate for electronic packaging application. The effect of plasma etching process on rigid flex substrate for electronic packaging application.

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