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Materials and Manufacturing Processes Volume 30, 2015 - Issue 7
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Original Articles

Investigation into Influence of Feed Speed on Surface Roughness in Wire Sawing

Zhenyuan JiaCollege of Mechanical Engineering, Dalian University of Technology, Dalian, Liaoning, P. R. China
,
Liqi ZhaoCollege of Mechanical Engineering, Dalian University of Technology, Dalian, Liaoning, P. R. China
,
Zongjin RenCollege of Mechanical Engineering, Dalian University of Technology, Dalian, Liaoning, P. R. ChinaCorrespondence[email protected]
,
Fei WangCollege of Mechanical Engineering, Dalian University of Technology, Dalian, Liaoning, P. R. China
,
Dong LiCollege of Mechanical Engineering, Dalian University of Technology, Dalian, Liaoning, P. R. China
&
Weilei JiCollege of Mechanical Engineering, Dalian University of Technology, Dalian, Liaoning, P. R. China
Pages 875-881 | Received 03 Apr 2014, Accepted 24 Oct 2014, Published online: 01 Apr 2015

Citations (10)

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Read on this site (4)

Ting-Chun Wang, Tsung-Han Yeh, Shao-Yu Chu, Hsin-Ying Lee & Ching-Ting Lee. (2020) Developed diamond wire sawing technique with high slicing ability for multicrystalline silicon wafers. Materials and Manufacturing Processes 35:15, pages 1727-1731.
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Wei Zhang, Chunyan Yao, Xuefeng Xu, Hejie Li & Kuangwei Li. (2018) Improvement of magnetic induction-wire sawing process using a magnetic system. Materials and Manufacturing Processes 33:6, pages 676-682.
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Lorena Zichella, Rossana Bellopede, Paola Marini, Alice Tori & Alessandro Stocco. (2017) Diamond wire cutting: A methodology to evaluate stone workability. Materials and Manufacturing Processes 32:9, pages 1034-1040.
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Chunyan Yao, Wei Zhang, Kun Liu, Hejie Li & Wei Peng. (2017) A pneumatic conveying method for the manufacturing of ultraviolet curing diamond wire saws. Materials and Manufacturing Processes 32:5, pages 523-529.
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Articles from other publishers (6)

Bin Wu, Zhenyu Zhang, Junyuan Feng, Fanning Meng, Shengzuo Wan, Xuye Zhuang, Li Li, Haoran Liu & Fuxu Zhang. (2023) Experimental Investigation on the Surface Formation Mechanism of NdFeB during Diamond Wire Sawing. Materials 16:4, pages 1521.
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Jintao Zheng, Peiqi Ge, Wenbo Bi, Yukang Zhao & Chao Wang. (2022) Effect of capillary adhesion on fracture of photovoltaic silicon wafers during diamond wire slicing. Solar Energy 238, pages 105-113.
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Jia Liu, Zhenyu Zhang, Shengzuo Wan, Bin Wu, Junyuan Feng, Tianyu Zhang & Chunchen Zhou. (2022) Experimental and Theoretical Investigations on Diamond Wire Sawing for a NdFeB Magnet. Materials 15:9, pages 3034.
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Jian Qiu, Xiaofei Li, Renpeng Ge & Chongning Liu. (2022) Surface formation, morphology, integrity and wire marks in diamond wire slicing of mono-crystalline silicon in the photovoltaic industry. Wear 488-489, pages 204186.
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Jintao Zheng, Peiqi Ge, Wenbo Bi, Yukang Zhao & Chao Wang. (2022) Action mechanism of liquid bridge between electroplated diamond wires for ultrathin wafer slicing. Solar Energy 231, pages 343-354.
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Peizhi Wang, Peiqi Ge, Yufei Gao & Wenbo Bi. (2017) Prediction of sawing force for single-crystal silicon carbide with fixed abrasive diamond wire saw. Materials Science in Semiconductor Processing 63, pages 25-32.
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