Investigation into Influence of Feed Speed on Surface Roughness in Wire Sawing

REFERENCES

• Masood, J.; Silvestri, P.; Zoppi, M.; Molfino, R. Pseudo-elastic wire application in robotized cutting systems. Automation in Construction 2013, 31, 103–113.
   Web of Science ®Google Scholar
• Watanabe, N.; Kondo, Y.; Ide, D.; Matsuki, T.; Takato, H.; Sakata, I. Characterization of polycrystalline silicon wafers for solar cells sliced with novel fixed-abrasive wire. Progress in Photovoltaics: Research and Applications 2010, 7 (18), 485–490.
   Web of Science ®Google Scholar
• Yao, C.Y.; Wang, M.H.; Peng, W. The progress of fixed abrasive wire saws in the last decade. Advanced Materials Research 2010, 97, 15–18.
   Google Scholar
• Huang, G.Q.; Huang, H.; Guo, H.; Xu, X.P. Influences of sawing parameters on forces and energy in wire sawing of granite. Journal of Mechanical Engineering 2009, 3, 038.
   Google Scholar
• Aslantas, K.; Özbek, O.; Ucun, I.; Buyuksagis, I.S. Investigation of the effect of axial cutting force on circular diamond sawblade used in marble cutting process. Materials and Manufacturing Processes 2009, 24 (12), 1423–1430.
   Web of Science ®Google Scholar
• Meissner, D.; Hurka, B.; Rietzschel, R.; Moller, H.J.; Anspach, O. Ideal combination of wire diameter and sic-grain size in the multi wire sawing process. In Proceedings of the 27th European Photovoltaic Solar Energy Conference and Exhibition, Frankfurt, Germany, September 24–28, 2012.
   Google Scholar
• Skomedal, G.; Ovrelid, E.J.; Armada, S.; Espallargas, N. Effect of slurry parameters on material removal rate in multi-wire sawing of silicon wafers: A tribological approach. Proceedings of the Institution of Mechanical Engineers 2011, 225 (10), 1023–1035.
   Google Scholar
• Kim, H.; Kim, D.; Kim, C.; Jeong, H. Multi-wire sawing of sapphire crystals with reciprocating motion of electroplated diamond wires. CIRP Annals-Manufacturing Technology 2013, 62 (1), 335–338.
   Web of Science ®Google Scholar
• Clark, W.I.; Shih, A.J.; Hardin, C.W.; Lemaster, R.L.; McSpadden, S.B. Fixed abrasive diamond wire machining—part I: Process monitoring and wire tension force. International Journal of Machine Tools and Manufacture 2003, 43 (5), 523–532.
   Web of Science ®Google Scholar
• Liedke, T.; Kuna, M. A macroscopic mechanical model of the wire sawing process. International Journal of Machine Tools and Manufacture 2011, 51 (9), 711–720.
   Web of Science ®Google Scholar
• Huang, H.; Huang, G.Q.; Xu, X.P.; Huang, H. An experimental study of machining characteristics and tool wear in the diamond wire sawing of granite. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 2013, 227 (7), 943–953.
   Web of Science ®Google Scholar
• Wu, H.; Melkote, S.N. Study of ductile-to-brittle transition in single grit diamond scribing of silicon: Application to wire sawing of silicon wafers. Journal of Engineering Materials and Technology 2012, 134 (4), 041011.
   Google Scholar
• Meng, J.F.; Li, J.F.; Ge, P.Q.; Gao, W. Removal mechanism in wire-sawing of hard-brittle material. Materials Science Forum 2004, 471, 192–195.
   Google Scholar
• Gao, Y.F.; Ge, P.Q.; Li, S.J.; Hou, Z.J. Research on influence of cutting fluid on slicing single-crystal silicon wafers quality using electroplated diamond wire saw. Journal of Wuhan University of Technology 2008, 30, 86–88.
   Google Scholar
• Meng, J.F.; Han, Y.P. Optimization of slicing parameters of single crystal silicon sliced by diamond wire saw. Advanced Materials Research 2012, 500, 89–93.
   Google Scholar
• Wang, X.Y.; Li, Y.; Li, S.J. Experimental study on reciprocating electroplated diamond wire saws cutting sic wafer. Key Engineering Materials 2011, 450, 296–299.
   Google Scholar
• Li, Y.; Wang, X.Y.; Li, S.J.; Zheng, J.M.; Yuan, Q.L. Experiments of ultrasonic-assisted wire sawing of SiC single crystal. Journal of Synthetic Crystals 2012, 4, 1076–1081.
   Google Scholar
• Pathak, B.N.; Sahoo, K.L.; Mishra, M. Effect of machining parameters on cutting forces and surface roughness in Al-(1–2) Fe-1V-1Si alloys. Materials and Manufacturing Processes 2013, 28 (4), 463–469.
   Web of Science ®Google Scholar
• Safari, H.; Sharif, S.; Izman, S.; Jafari, H.; Kurniawan, D. Cutting force and surface roughness characterization in cryogenic high-speed end milling of Ti–6Al-4V ELI. Materials and Manufacturing Processes 2014, 29 (3), 344–350.
   Web of Science ®Google Scholar
• Preston, F.W. Glass technology. Journal of the Society of Glass Technology 1927, 11, 277–281.
   Google Scholar
• Gao, Y.F.; Ge, P.Q. Experimental investigation on Brittle-ductile transition in electroplated diamond wire saw machining single crystal silicon. Key Engineering Materials 2010, 431–432, 265–268.
   Google Scholar