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Original Articles

Improvement of magnetic induction-wire sawing process using a magnetic system

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Pages 676-682 | Received 04 May 2017, Accepted 25 Jul 2017, Published online: 29 Aug 2017

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Ting-Chun Wang, Tsung-Han Yeh, Shao-Yu Chu, Hsin-Ying Lee & Ching-Ting Lee. (2020) Developed diamond wire sawing technique with high slicing ability for multicrystalline silicon wafers. Materials and Manufacturing Processes 35:15, pages 1727-1731.
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Articles from other publishers (3)

Chao-Ching Ho, Yong-Zhi Deng, Bo-En Tsai & Chia-Lung Kuo. (2022) Study on magnetic-field-based abrasive grains patterning for electroplating diamond wire saws. Journal of Laser Applications 34:2.
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Wei Zhang. (2022) An Analysis of the Formation Mechanisms of Abrasive Particles and Their Effects on Cutting Efficiency. Fluid Dynamics & Materials Processing 18:4, pages 1153-1167.
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Atul Babbar, Ankit Sharma & Parminderjeet Singh. (2022) Multi-objective optimization of magnetic abrasive finishing using grey relational analysis. Materials Today: Proceedings 50, pages 570-575.
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