Improvement of magnetic induction-wire sawing process using a magnetic system

References

• Jia, Z. Y.; Zhao, L. Q.; Ren, Z. J.; Wang, F.; Li, D.; Ji, W.L. Investigation into Influence of Feed Speed on Surface Roughness in Wire Sawing. Mater. Manuf. Processes 2015, 30, 875–881. DOI:10.1080/10426914.2014.984211
   Web of Science ®Google Scholar
• Powell, D. M.; Fu, R.; Horowitz, K.; Basore, P. A.; Woodhouse, M.; Buonassisi, T. The Capital Intensity of Photovoltaics Manufacturing: Barrier to Scale and Opportunity for Innovation. Energy Environ. Sci. 2015, 8, 3395–3408. DOI:10.1039/c5ee01509j
   Web of Science ®Google Scholar
• Wu, H. Wire Sawing Technology: A State-of-the-Art Review. Precis. Eng. 2016, 43, 13–15. DOI:10.1016/j.precisioneng.2015.08.008
   Web of Science ®Google Scholar
• Yao, C. Y.; Zhang, W.; Liu, K.; Li, H. J.; Peng, W. A Pneumatic Conveying Method for Manufacturing of Ultraviolet Curing Diamond Wire Saws. Mater. Manuf. Processes 2017, 32, 523–529. DOI:10.1080/10426914.2016.1257130
   Web of Science ®Google Scholar
• Schwinde, S.; Berg, M.; Kunert, M. New Potential for Reduction of Kerf Loss and Wire Consumption in Multi-Wire Sawing. Sol. Energy Mater. Sol. Cells 2015, 136, 44–47. DOI:10.1016/j.solmat.2014.12.020
   Web of Science ®Google Scholar
• Wang, W.; Liu, Z. Grinding/Electrolysis Combined Multi-Wire-Slicing Processing method for Silicon Wafers. United States Patent, US 8747625 B2, 2014.
   Google Scholar
• Bao, G.; Wang, W.; Zhang, L. Mechanism of Material Removal in Abrasive Electrochemical Multi-Wire Sawing of Multi-Crystalline Silicon Ingots into Wafers. Int. J. Adv. Manuf. Technol. 2016, 91, 383–388. DOI:10.1007/s00170-016-9718-6
   Web of Science ®Google Scholar
• Anspach, O.; Hurka, B.; Sunder, K. Structured Wire: From Single Wire Experiments to Multi-Crystalline Silicon Wafer Mass Production. Sol. Energy Mater. Sol. Cells 2014, 131, 58–63. DOI:10.1016/j.solmat.2014.06.008
   Web of Science ®Google Scholar
• Nassauer, B.; Hess, A.; Kuna, M. Numerical and Experimental Investigations of Micromechanical Processes During Wire Sawing. Int. J. Solids Struct. 2014, 51, 2656–2665. DOI:10.1016/j.ijsolstr.2014.03.040
   Web of Science ®Google Scholar
• Beiranvand, R. Effects of the Winding Cross Section Shape on the Magnetic Field Uniformity of the High Field Circular Helmholtz Coil Systems. IEEE Trans. Ind. Electron. 2017, 64, 7120–7131. DOI:10.1109/tie.2017.2686302
   Web of Science ®Google Scholar
• Yao, C. Y.; Tang, C.; Qiu, T. W.; Zhang, W.; Peng, W. Numerical Analysis and Theoretical Analysis in High Gradient Magnetic Field Based on Wire of Wire Sawing. Mod. Manuf. Eng. 2016, 02, 16–21(in Chinese).
   Google Scholar
• Qiu, T. W.; Yao, C. Y.; Zhang, W.; Tang, C.; Peng, W.; Wang, Y. Experimental Study of the Cutting Performance of Free-Abrasive Wire Sawing in a Magnetic Field. Int. J. Adv. Manuf. Technol. 2016, 87, 3113–3122. DOI:10.1007/s00170-016-8719-9
   Web of Science ®Google Scholar
• Wang, Y. Z. Practical Magnetic Circuit Design; National Defend Industry Press: Beijing, China, 2008 (in Chinese).
   Google Scholar
• Lin, Q. R. Principle of Magnetic Circuit Design; China Machine Press: Beijing, China, 1987 (in Chinese).
   Google Scholar
• Zhang, W.; Yao, C. Y.; Tang, C.; Qiu, T. W.; Xu, X. F. Investigations on the Trajectories of Magnetic Abrasive Grains in Magnetic Induction-Free Abrasive Wire Sawing. J. Magnet. Magnet. Mater. 2016, 419, 317–324. DOI:10.1016/j.jmmm.2016.06.023
   Web of Science ®Google Scholar
• Skomedal, G.; Øvrelid, E. J.; Armada, S.; Espallargas, N. Effect of Slurry Parameters on Material Removal Rate in Multi-Wire Sawing of Silicon Wafers: A Tribological Approach. Proc. Inst. Mech. Eng. Part J 2011, 225(10), 1023–1035. DOI:10.1177/1350650111411246
   Web of Science ®Google Scholar
• Retsch, S.; Jentsch, S.; Möller, H. J. Influence of Shape and Size Distribution of Abrasives on the Cutting Performance of Multi Wire Sawing and Lapping. In 27rd European Photovoltaic Solar Energy Conference and Exhibition, Frankfurt, Germany, September 24–28, 2012.
   Google Scholar
• Bidiville, A.; Wasmer, K.; Meer, M. V. D.; Ballif, C. Wire-Sawing Processes: Parametrical Study and Modeling. Sol. Energy Mater. Sol. Cells 2015, 132, 392–402. DOI:10.1016/j.solmat.2014.09.019
   Web of Science ®Google Scholar