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Materials and Manufacturing Processes Volume 38, 2023 - Issue 3
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Research Article

Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging

Karan Pawara Electrochemical Microfabrication Laboratory, Department of Mechanical Engineering, Indian Institute of Technology Bombay, Mumbai, IndiaView further author information
,
Harsha Sb Central Manufacturing Technology Institute, Bengaluru, IndiaView further author information
&
Pradeep Dixita Electrochemical Microfabrication Laboratory, Department of Mechanical Engineering, Indian Institute of Technology Bombay, Mumbai, IndiaCorrespondence[email protected]
ORCID Iconhttps://orcid.org/0000-0001-6706-1877View further author information
ORCID Icon
Pages 284-294 | Received 09 May 2022, Accepted 06 Jul 2022, Published online: 28 Jul 2022

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Read on this site (3)

Dileep Kumar Mishra & Pradeep Dixit. (2023) Fabrication of 3D microstructures in glass by direct writing electrochemical discharge machining. Materials and Manufacturing Processes 38:8, pages 999-1008.
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Karan Pawar & Pradeep Dixit. (2022) A critical review of copper electroless deposition on glass substrates for microsystems packaging applications. Surface Engineering 38:6, pages 576-617.
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Anurag Shanu, Priyaranjan Sharma & Pradeep Dixit. Micromachining of alumina ceramic for microsystems applications: a systematic review, challenges and future opportunities. Materials and Manufacturing Processes 0:0, pages 1-33.
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Articles from other publishers (2)

Siliang He, Bifu Xiong, Fangyi Xu, Biyang Chen, Yinhua Cui, Chuan Hu, Gao Yue & Yu-An Shen. (2023) Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere. Materials 16:6, pages 2389.
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Min Jiang, Min Yu, Bao Li, Hongze Zhang & Zhiyuan Zhu. (2022) Al-Sn-Al Bonding Strength Investigation Based on Deep Learning Model. Processes 10:10, pages 1899.
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