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Integrated Ferroelectrics
An International Journal
Volume 66, 2004 - Issue 1
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Original Articles

Integration of MOCVD SBT Stacked Ferroelectric Capacitors in a 0.35 μ m CMOS Technology

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Pages 71-83 | Received 01 Apr 2004, Accepted 01 May 2004, Published online: 12 Aug 2010

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J.G. LISONI, J.A. JOHNSON, J.-L. EVERAERT, L. GOUX, H. VANDER MEEREN, V. PARASCHIV, M. WILLEGEMS, D. MAES, L. HASPESLAGH, D.J. WOUTERS, C. CAPUTA & R. ZAMBRANO. (2006) MECHANICAL STABILITY OF Ir ELECTRODES USED FOR STACKED SrBi2Ta2O9 FERROELECTRIC CAPACITORS. Integrated Ferroelectrics 81:1, pages 37-45.
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Articles from other publishers (6)

Chia-Ching Lee, Jenn-Ming Wu & Chang-Po Hsiung. (2007) Highly (110)- and (111)-oriented BiFeO3 films on BaPbO3 electrode with Ru or Pt∕Ru barrier layers. Applied Physics Letters 90:18.
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J. G. Lisoni, J. A. Johnson, L. Goux, V. Paraschiv, D. Maes, H. Van der Meeren, M. Willegems, L. Haspeslagh, D. J. Wouters, C. Caputa, R. Zambrano, Ch. Turquat & Ch. Muller. (2007) Enhanced oxidation of TiAlN barriers integrated in three-dimensional ferroelectric capacitor structures. Journal of Applied Physics 101:1.
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L. Goux, D. Maes, J.G. Lisoni, H. Vander Meeren, V. Paraschiv, L. Haspeslagh, C. Artoni, G. Russo, R. Zambrano & D.J. Wouters. (2006) Scaling potential of pin-type 3-D SBT ferroelectric capacitors integrated in 0.18μm CMOS technology. Microelectronic Engineering 83:10, pages 2027-2031.
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D. J. Wouters, D. Maes, L. Goux, J. G. Lisoni, V. Paraschiv, J. A. Johnson, M. Schwitters, J.-L. Everaert, W. Boullart, M. Schaekers, M. Willegems, H. Vander Meeren, L. Haspeslagh, C. Artoni, C. Caputa, P. Casella, G. Corallo, G. Russo, R. Zambrano, H. Monchoix, G. Vecchio & L. Van Autryve. (2006) Integration of SrBi2Ta2O9 thin films for high density ferroelectric random access memory. Journal of Applied Physics 100:5.
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L. Goux, Z. Xu, V. Paraschiv, J.G. Lisoni, D. Maes, L. Haspeslagh, G. Groeseneken & D.J. Wouters. (2006) Influence of different deposition conditions of top and bottom electrode on the reliability of Sr0.8Bi2.2Ta2O9 ferroelectric capacitors. Solid-State Electronics 50:7-8, pages 1227-1234.
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P. Soussan, L. Goux, M. Dehan, H.V. Meeren, G. Potoms, D.J. Wouters & E. Beyne. (2006) Low Temperature Technology Options for Integrated High Density Capacitors. Low Temperature Technology Options for Integrated High Density Capacitors.

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