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Integrated Ferroelectrics
An International Journal
Volume 16, 1997 - Issue 1-4
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Device intergration issues and testing

Etching effects to PZT capacitors with RuOx/Pt electrode by using inductively coupled plasma

Chang Jung Kim Materials and Devices Research Center, Samsung Advanced Institute of Technology, P.O. Box 111, Suwon, 440-600, Korea
,
J. Key Lee Materials and Devices Research Center, Samsung Advanced Institute of Technology, P.O. Box 111, Suwon, 440-600, Korea
,
C. Won Chung Materials and Devices Research Center, Samsung Advanced Institute of Technology, P.O. Box 111, Suwon, 440-600, Korea
&
I. Chung Materials and Devices Research Center, Samsung Advanced Institute of Technology, P.O. Box 111, Suwon, 440-600, Korea
Pages 149-157 | Received 18 Mar 1996, Published online: 19 Aug 2006

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J. Baborowski, P. Muralt, N. Ledermann, E. Colla, A. Seifert, S. Gentil & N. Setter. (2000) Mechanisms of Pb(zr0.53Ti0.47)O3 thin film etching with ECR/RF reactor. Integrated Ferroelectrics 31:1-4, pages 261-271.
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Hiroto Uchida, Nobuyuki Soyama, Kensuke Kageyama, Katsumi Ogi, MikeC. Scott, JoeD. Cuchiaro, LarryD. Mcmillan & CarlosA.Paz De Araujo. (1997) Characterization of self-patterned SBT/SBNT thin films from photo-sensitive solutions. Integrated Ferroelectrics 18:1-4, pages 249-261.
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Articles from other publishers (2)

L.-P. Wang, R. Wolf, Q. Zhou, S. Trolier-McKinstry & R. J. Davis. (2011) Wet-Etch Patterning of Lead Zirconate Titanate (PZT) Thick Films for Microelectromechanical Systems (MEMS) Applications. MRS Proceedings 657.
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Shinan Wang, Xinghua Li, Katsuhiro Wakabayashi & Masayoshi Esashi. (2004) Deep Reactive Ion Etching of Lead Zirconate Titanate Using Sulfur Hexafluoride Gas. Journal of the American Ceramic Society 82:5, pages 1339-1641.
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