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Materials Research Letters Volume 9, 2021 - Issue 6
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Original Report

A high-entropy high-temperature shape memory alloy with large and complete superelastic recovery

Shaohui Lia Beijing Advanced Innovation Center for Materials Genome Engineering, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, People’s Republic of ChinaORCID Iconhttps://orcid.org/0000-0003-3078-0338View further author information
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Daoyong Conga Beijing Advanced Innovation Center for Materials Genome Engineering, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, People’s Republic of ChinaCorrespondence[email protected]
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Zhen Chena Beijing Advanced Innovation Center for Materials Genome Engineering, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, People’s Republic of ChinaView further author information
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Shengwei Lia Beijing Advanced Innovation Center for Materials Genome Engineering, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, People’s Republic of ChinaView further author information
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Chao Songa Beijing Advanced Innovation Center for Materials Genome Engineering, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, People’s Republic of ChinaView further author information
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Yuxian Caoa Beijing Advanced Innovation Center for Materials Genome Engineering, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, People’s Republic of ChinaView further author information
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Zhihua Nieb School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, People’s Republic of ChinaView further author information
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Yandong Wanga Beijing Advanced Innovation Center for Materials Genome Engineering, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, People’s Republic of ChinaView further author information
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Pages 263-269 | Received 12 Jan 2021, Published online: 28 Feb 2021

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