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Cogent Engineering Volume 5, 2018 - Issue 1

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Research Article

Physical properties of some unfilled resins employed in semiconductor packages

Enis Tuncer Semiconductor Packaging, Technology & Manufacturing Group, Texas Instruments Incorporated , 13020 TI Boulevard-MS3621, Dallas, TX, 75243USACorrespondence[email protected]

https://orcid.org/0000-0002-9324-4324 View further author information

Alex Hernandez-Luna Semiconductor Packaging, Technology & Manufacturing Group, Texas Instruments Incorporated , 13020 TI Boulevard-MS3621, Dallas, TX, 75243USAView further author information

Nan Liu Western Digital Corporation , USAView further author information

(Reviewing Editor)

Article: 1441586 | Received 14 Dec 2017, Accepted 11 Feb 2018, Published online: 28 Feb 2018

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https://doi.org/10.1080/23311916.2018.1441586
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