Cogent Engineering
Volume 5, 2018 - Issue 1
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Research Article
Physical properties of some unfilled resins employed in semiconductor packages
Enis Tuncer
Semiconductor Packaging, Technology & Manufacturing Group, Texas Instruments Incorporated
, 13020 TI Boulevard-MS3621, Dallas, TX, 75243USACorrespondence[email protected]
https://orcid.org/0000-0002-9324-4324View further author information
& https://orcid.org/0000-0002-9324-4324View further author information
Alex Hernandez-Luna
Semiconductor Packaging, Technology & Manufacturing Group, Texas Instruments Incorporated
, 13020 TI Boulevard-MS3621, Dallas, TX, 75243USAView further author information
| Nan Liu
Western Digital Corporation
, USAView further author information
(Reviewing Editor)
Article: 1441586
|
Received 14 Dec 2017, Accepted 11 Feb 2018, Published online: 28 Feb 2018
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