40
Views
6
CrossRef citations to date
0
Altmetric
Articles

Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications

Pages 87-94 | Published online: 02 Apr 2012

Keep up to date with the latest research on this topic with citation updates for this article.

Read on this site (1)

Yung-Sen Lin & Sheng-Shiang Chiu. (2008) Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles. Journal of Adhesion Science and Technology 22:14, pages 1673-1697.
Read now

Articles from other publishers (5)

Yao Li, Jeffery A. Hinkley & Karl I. Jacob. 2021. Nano-Bio- Electronic, Photonic and MEMS Packaging. Nano-Bio- Electronic, Photonic and MEMS Packaging 537 554 .
C. P. Wong & Kyoung-sik Moon. 2021. Nano-Bio- Electronic, Photonic and MEMS Packaging. Nano-Bio- Electronic, Photonic and MEMS Packaging 3 13 .
Yu Yang Zhang & Shi Xing Wang. (2011) Rheological and Flocculated Properties of Silver Nanoparticles Paste. Advanced Materials Research 236-238, pages 2197-2201.
Crossref
Yao Li, Jeffrey A. Hinkley & Karl I. Jacob. 2010. Nano-Bio- Electronic, Photonic and MEMS Packaging. Nano-Bio- Electronic, Photonic and MEMS Packaging 665 694 .
C. P. Wong & Kyoung-sik (Jack) Moon. 2010. Nano-Bio- Electronic, Photonic and MEMS Packaging. Nano-Bio- Electronic, Photonic and MEMS Packaging 1 17 .

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.