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Articles

Susceptibility and Coupled Waveform of Microcontroller Device by Impact of UWB-HPEM

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Pages 1059-1067 | Published online: 03 Apr 2012

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X.-F. Lu, G.-H. Wei & X.-D. Pan. (2013) A directional-coupler-based injection device aimed at radiated susceptibility verification of antenna systems against HIRF. Journal of Electromagnetic Waves and Applications 27:11, pages 1351-1364.
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Ning Li, Yang Li, Yaxin Guo & Chaohui He. (2023) Simulation analysis of electromagnetic pulse susceptibility and hardening design for system-in-package SZ0501. Microelectronics Reliability 141, pages 114892.
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Kaibai Chen, Shaohua Liu, Min Gao & Xiaodong Zhou. (2022) Simulation and Analysis of an FMCW Radar against the UWB EMP Coupling Responses on the Wires. Sensors 22:12, pages 4641.
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Qi-Shuai Liang, Chang-Chun Chai, Han Wu, Yu-Qian Liu, Fu-Xing Li & Yin-Tang Yang. (2021) Mechanism Analysis and Thermal Damage Prediction of High-Power Microwave Radiated CMOS Circuits. IEEE Transactions on Device and Materials Reliability 21:3, pages 444-451.
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Sangin Kim, Yeong-Hoon Noh, Jinhyo Lee, Jongwon Lee, Jin-Soo Choi & Jong-Gwan Yook. (2019) Electromagnetic Signature of a Quadcopter Drone and Its Relationship With Coupling Mechanisms. IEEE Access 7, pages 174764-174773.
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D.S. Kim, J.H. Choi, N.C. Park, S.I. Chan & Y.C. Jeong. (2018) Analysis of semiconductor fault using DS (damped sinusoidal) HPEM injection. Microelectronics Reliability 88-90, pages 411-417.
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Jin-Wook Park, Chang-Su Huh, Chang-Su Seo & Sung-Woo Lee. (2016) A Study on Malfunction Mode of CMOS IC Under Narrow-Band High-Power Electromagnetic Wave. Journal of the Korean Institute of Electrical and Electronic Material Engineers 29:9, pages 559-564.
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Jie Chen & Zhengwei Du. (2014) Theoretical models for microwave pulse induced thermal failure in CMOS integrated circuits. Microwave and Optical Technology Letters 56:5, pages 1144-1151.
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Jeong-Ju Bang, Chang-Su Huh & Jong-Won Lee. (2014) A Study on Destruction Characteristics of BJT (Bipolar Junction Transistor) at Different Pulse Repetition Rate. Journal of the Korean Institute of Electrical and Electronic Material Engineers 27:3, pages 167-171.
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