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Ligeng Shao, Liqun Du, Chong Liu & Liding Wang. (2014) Microstructure and mechanical properties of nanocrystalline nickel prepared by pulse reverse microelectroforming. Journal of Experimental Nanoscience 9:3, pages 299-309.
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C Larson & J P G Farr*. (2012) Current research and potential applications for pulsed current electrodeposition – a review. Transactions of the IMF 90:1, pages 20-29.
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J. P. G. Farr. (2010) Electroplating, electrode kinetics and electrocrystallisation. Transactions of the IMF 88:5, pages 262-265.
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Articles from other publishers (6)
Joseph Bauer & Michael Moats. (2022) Analytical and Approximate Current Distributions in the Rotating Cylinder Hull Cell. Journal of The Electrochemical Society 169:12, pages 123504.
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Wen Ge, Wensheng Li, Rihong Li, Yifan Dong, Ziming Zeng, Hui Cao, Longlin Yu, Zhijie Wen & Jin He. (2022) Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating. Coatings 12:7, pages 995.
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Michael D. Sinanis, Pintu Adhikari, Thomas R. Jones, Mahmoud Abdelfattah & Dimitrios Peroulis. (2022) High-Q High Power Tunable Filters Manufactured With Injection Molding Technology. IEEE Access 10, pages 19643-19653.
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Susan L. Burkett, Matthew B. Jordan, Rebecca P. Schmitt, Lyle A. Menk & Andrew E. Hollowell. (2020) Tutorial on forming through-silicon vias. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 38:3.
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Linxian Ji, Chong Wang, Shouxu Wang, Kai Zhu, Wei He & Dingjun Xiao. (2016) Multi-physics coupling aid uniformity improvement in pattern plating. Circuit World 42:2, pages 69-76.
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