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Transactions of the IMF
The International Journal of Surface Engineering and Coatings
Volume 93, 2015 - Issue 4
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Original Articles

Investigation of suppressor polyethylene glycol dodecyl ether on electroplated Cu filling by electrochemical method

S. RenKey Laboratory of Applied Surface and Colloid ChemistryMinistry of Education, and School of Chemistry and Chemical Engineering, Shaanxi Normal University, Xi'an710062, China
,
Z. LeiKey Laboratory of Applied Surface and Colloid ChemistryMinistry of Education, and School of Chemistry and Chemical Engineering, Shaanxi Normal University, Xi'an710062, China
&
Z. WangKey Laboratory of Applied Surface and Colloid ChemistryMinistry of Education, and School of Chemistry and Chemical Engineering, Shaanxi Normal University, Xi'an710062, ChinaCorrespondence[email protected]
Pages 190-195 | Received 29 Jan 2015, Accepted 26 May 2015, Published online: 16 Jun 2015

Citations (9)

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Read on this site (1)

Shenghao Zhao, Kaining Pang, Yaning Huang & Ning Xiao. (2019) Special electrochemical behaviour of sodium thiazolinyl-dithiopropane sulphonate during microvia filling. Transactions of the IMF 97:4, pages 217-224.
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Articles from other publishers (8)

Ran Zhang, Sen Yang, Shuiping Qin, Pengju Wang, Wenchang Wang, Naotoshi Mitsuzaki & Zhidong Chen. (2023) Effects of DPS on Surface Roughness and Mechanical Properties of Electrodeposited Copper Foils. Crystal Research and Technology 58:10.
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Xulingjie Teng, Zhihua Tao, Zhiyuan Long, Guanting Liu & Xuefei Tao. (2022) 1-(4-Hydroxyphenyl)-2 H -tetrazole-5-thione as a leveler for acid copper electroplating of microvia . RSC Advances 12:25, pages 16153-16164.
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Jun Li, Jie Xu, Xiaomin Wang, Xiaochuan Wei & Limin Wang. (2021) Diketopyrrolopyrrole-based supramolecular nano-leveler for the enhancement of conformal copper electrodeposition. Applied Surface Science 569, pages 150982.
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Jun Li, Jie Xu, Xiaomin Wang, Xiaochuan Wei, Jinge Lv & Limin Wang. (2021) Novel 2,5-bis(6-(trimethylamonium)hexyl)-3,6-diaryl-1,4-diketopyrrolo[3,4-c]pyrrole pigments as levelers for efficient electroplating applications. Dyes and Pigments 186, pages 109064.
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Zhen Li, Baizhao Tan, Minghao Shi, Jiye Luo, Zhifeng Hao, Jun He, Guannan Yang & Chengqiang Cui. (2020) Bis-(sodium sulfoethyl)-disulfide: A Promising Accelerator for Super-conformal Copper Electrodeposition with Wide Operating Concentration Ranges. Journal of The Electrochemical Society 167:4, pages 042508.
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Xudong Zhang, Xiaowu Hu, Xiongxin Jiang, Liuru Zhou & Qinglin Li. (2019) Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints. Journal of Materials Science: Materials in Electronics 31:3, pages 2320-2330.
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Chaohui Liao, Shengtao Zhang, Shijin Chen, Yujie Qiang, Gen Liu, Mingxing Tang, Bochuan Tan, Denglin Fu & Yue Xu. (2018) The effect of tricyclazole as a novel leveler for filling electroplated copper microvias. Journal of Electroanalytical Chemistry 827, pages 151-159.
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Chun Chang, Xubin Lu, Zhanwu Lei, Zenglin Wang & Chuan Zhao. (2016) 2-Mercaptopyridine as a new leveler for bottom-up filling of micro-vias in copper electroplating. Electrochimica Acta 208, pages 33-38.
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