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The International Journal of Surface Engineering and Coatings

Volume 93, 2015 - Issue 4

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Investigation of suppressor polyethylene glycol dodecyl ether on electroplated Cu filling by electrochemical method

S. RenKey Laboratory of Applied Surface and Colloid ChemistryMinistry of Education, and School of Chemistry and Chemical Engineering, Shaanxi Normal University, Xi'an710062, China

Z. LeiKey Laboratory of Applied Surface and Colloid ChemistryMinistry of Education, and School of Chemistry and Chemical Engineering, Shaanxi Normal University, Xi'an710062, China

Z. WangKey Laboratory of Applied Surface and Colloid ChemistryMinistry of Education, and School of Chemistry and Chemical Engineering, Shaanxi Normal University, Xi'an710062, ChinaCorrespondence[email protected]

Pages 190-195 | Received 29 Jan 2015, Accepted 26 May 2015, Published online: 16 Jun 2015

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https://doi.org/10.1179/0020296715Z.000000000251
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