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Materials Science and Technology Volume 19, 2003 - Issue 1
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Articles

Effect of transient liquid phase diffusion bonding on properties of ODS nickel alloy MA758

A. EkramiDepartment of Material Science and Engineering Sharif University of Technology, Tehran , Iran
,
T.I. KhanDepartment of Design Faculty of Technology, Brunel University, Uxbridge, Middlessex , UK
&
H. MalikDepartment of Mechanical Engineering International Islamic University of Malaysia , Kuala Lumpar, Malaysia
Pages 132-136 | Published online: 19 Jul 2013

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Casey S. Carney, Richard P. Oleksak, Monica Kapoor, Gordon R. Holcomb & Ömer N. Doğan. (2020) High-temperature oxidation of transient-liquid phase bonded Ni-based alloys in 1 bar and 250 bar carbon dioxide. Materials at High Temperatures 37:6, pages 445-461.
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D.Q. Sun, W.H. Liu & X.Y. Gu. (2004) Transient liquid phase bonding of magnesium alloy (Mg – 3Al – 1Zn) using copper interlayer. Materials Science and Technology 20:12, pages 1595-1598.
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Articles from other publishers (12)

Ali Izadi Ghahferokhi, Masoud Kasiri-Asgarani, Kamran Amini, Reza Ebrahimi-kahrizsangi & Mahdi Rafiei. (2020) Evolution of microstructure and mechanical properties on dissimilar transient liquid phase (TLP) bonding of GTD-111 and IN-718 by BNi-9 (AWS A5.8/A5.8M) interlayer. Welding in the World 65:2, pages 329-343.
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Ali Ebrahimzadeh Pilehrood, Hamid Omidvar, Ali Shamsipur & Zainuddin Sajuri. (2020) Influence of transient liquid phase bonding followed by homogenization on the fatigue lifetimes of inconel 738 at elevated temperature. Journal of Manufacturing Processes 55, pages 348-358.
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K.A. Rozman, M.A. Carl, M. Kapoor, Ö.N. Doğan & J.A. Hawk. (2019) Creep performance of transient liquid phase bonded haynes 230 alloy. Materials Science and Engineering: A 768, pages 138477.
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Arash Kazazi & Aliakbar Ekrami. (2019) Corrosion behavior of TLP bonded stainless steel 304 with Ni-based interlayer. Journal of Manufacturing Processes 42, pages 131-138.
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Ahmed SharifTariq Islam & Ahmed Sharif. 2019. Harsh Environment Electronics. Harsh Environment Electronics 263 292 .
Grant O. CookIIIIII & Carl D. Sorensen. (2011) Overview of transient liquid phase and partial transient liquid phase bonding. Journal of Materials Science 46:16, pages 5305-5323.
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V. Thirunavukkaasu,J. Maniraj,K. Kumaresan,K. M. Senthil Kumar,K. Kanthavel,. (2009) Investigation and Experimental Analysis of Diffusion Bonding of Al 6061/Sicp Materials. Journal for Manufacturing Science and Production 10:3-4, pages 213-230.
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M. Pouranvari, A. Ekrami & A.H. Kokabi. (2008) Microstructure–properties relationship of TLP-bonded GTD-111 nickel-base superalloy. Materials Science and Engineering: A 490:1-2, pages 229-234.
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M. Pouranvari, A. Ekrami & A.H. Kokabi. (2008) Microstructure development during transient liquid phase bonding of GTD-111 nickel-based superalloy. Journal of Alloys and Compounds 461:1-2, pages 641-647.
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A. Ekrami, S. Moeinifar & A.H. Kokabi. (2007) Effect of transient liquid phase diffusion bonding on microstructure and properties of a nickel base superalloy Rene 80. Materials Science and Engineering: A 456:1-2, pages 93-98.
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R.K. Saha, S. Wei & T.I. Khan. (2005) A comparison of microstructural developments in TLP diffusion bonds made using ODS Ni alloy. Materials Science and Engineering: A 406:1-2, pages 319-327.
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D.Q. Sun, X.Y. Gu & W.H. Liu. (2005) Transient liquid phase bonding of magnesium alloy (Mg–3Al–1Zn) using aluminium interlayer. Materials Science and Engineering: A 391:1-2, pages 29-33.
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