Process–microstructure–properties relationship during formation of AlN layers by physical vapour deposition

U. FigueroaInstituto Tecnológico y de Estudios Superiores de Monterrey-Campus Estado de México, Carretera a Lago de Guadalupe km 3.5, Atizapán, 52926, México

O. SalasInstituto Tecnológico y de Estudios Superiores de Monterrey-Campus Estado de México, Carretera a Lago de Guadalupe km 3.5, Atizapán, 52926, MéxicoCorrespondence[email protected]

J. OsegueraInstituto Tecnológico y de Estudios Superiores de Monterrey-Campus Estado de México, Carretera a Lago de Guadalupe km 3.5, Atizapán, 52926, México

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Karan Pawar & Pradeep Dixit. (2022) A critical review of copper electroless deposition on glass substrates for microsystems packaging applications. Surface Engineering 38:6, pages 576-617.
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T. S. Hua, B. Zhu & R. G. Song. (2020) Characterisation of AlN nano thin films prepared by PLD. Surface Engineering 36:1, pages 55-62.
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S Yogesha, K R Udupa & A C Hegde. (2012) Surface modification by multilayered Zn–Co alloy coatings. Surface Engineering 28:1, pages 49-56.
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C W Chen, D Y Chen, C Y Hsu, Y H Chang & K H Hou. (2011) Spectrally selective Al/AlN/Al/AlN tandem solar absorber by inline reactive ac magnetron sputtering. Surface Engineering 27:8, pages 616-622.
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Articles from other publishers (2)

Qiu-ping WEI, Xiong-wei ZHANG, Dan-ying LIU, Jie LI, Ke-chao ZHOU, Dou ZHANG & Zhi-ming YU. (2014) Effects of sputtering pressure on nanostructure and nanomechanical properties of AlN films prepared by RF reactive sputtering. Transactions of Nonferrous Metals Society of China 24:9, pages 2845-2855.
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J. Acosta, A. Rojo, O. Salas & J. Oseguera. (2007) Process monitoring during AlN deposition by reactive magnetron sputtering. Surface and Coatings Technology 201:18, pages 7992-7999.
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Process–microstructure–properties relationship during formation of AlN layers by physical vapour deposition

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Process–microstructure–properties relationship during formation of AlN layers by physical vapour deposition

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