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Transactions of the IMF
The International Journal of Surface Engineering and Coatings
Volume 88, 2010 - Issue 3
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Transactions

Effect of PEG molecular weight on bottom-up filling of copper electrodeposition for PCB interconnects

L. YinKey Laboratory of Applied Surface and Colloid Chemistry of Ministry of EducationSchool of Chemistry and Materials Science, Shaanxi Normal University, Xi'an, 710062, China
,
Z. H. LiuKey Laboratory of Applied Surface and Colloid Chemistry of Ministry of EducationSchool of Chemistry and Materials Science, Shaanxi Normal University, Xi'an, 710062, China
,
Z. P. YangKey Laboratory of Applied Surface and Colloid Chemistry of Ministry of EducationSchool of Chemistry and Materials Science, Shaanxi Normal University, Xi'an, 710062, China
,
Z. L. WangKey Laboratory of Applied Surface and Colloid Chemistry of Ministry of EducationSchool of Chemistry and Materials Science, Shaanxi Normal University, Xi'an, 710062, China;, Email: [email protected]
&
S. ShingubaraDepartment of Mechanical EngineeringKansai University, Osaka, Japan
Pages 149-153 | Published online: 29 Nov 2013

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Read on this site (4)

N Fukumuro, T Adachi, S Yae, H Matsuda & Y Fukai. (2011) Influence of hydrogen on room temperature recrystallisation of electrodeposited Cu films: thermal desorption spectroscopy. Transactions of the IMF 89:4, pages 198-201.
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M Gu & Q Zhong. (2011) Influence of MPS concentration on copper electrocrystallisation from acidic sulphate electrolyte with MPS additive systems. Transactions of the IMF 89:4, pages 187-193.
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J R Smith, C Larson & S A Campbell. (2011) Recent applications of SEM and AFM for assessing topography of metal and related coatings — a review. Transactions of the IMF 89:1, pages 18-27.
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Z.X. Wang, S. Wang, Z. Yang & Z.L. Wang. (2010) Influence of additives and pulse parameters on uniformity of through-hole copper plating. Transactions of the IMF 88:5, pages 272-276.
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Articles from other publishers (13)

Ran Zhang, Sen Yang, Shuiping Qin, Pengju Wang, Wenchang Wang, Naotoshi Mitsuzaki & Zhidong Chen. (2023) Effects of DPS on Surface Roughness and Mechanical Properties of Electrodeposited Copper Foils. Crystal Research and Technology 58:10.
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Chaojie Zheng, Tao Zhang, Haidi Li, Shiqi Song, Xixun Shen, Qiaoxia Li, Wei He, Yuanming Chen, Yanxia Jiang, Rui Huang & Qunjie Xu. (2023) Research progress of additives for electroplating copper in high-end electronic manufacturing. SCIENTIA SINICA Chimica.
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Xiao-Hui Yang, Pei-Bin Kang, Fan-Jie Xu, Yu-Cheng Jin, Yu-Hang Tang, Yan-Yi Su, Jiang-Pen Qiu & Jun Cheng. (2023) Artificial intelligence and computational chemistry: a new perspective for electroplating-surface-interface research. SCIENTIA SINICA Chimica.
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Yujue Wang, Xiangui Zheng & Xiuyan Li. (2023) Effect of polyethylene glycol molecular weight on the electrodeposition of nanostructured nickel. Applied Surface Science 623, pages 156886.
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Chuan Peng, Yuehui Zhai, Xianming Chen, Chong Wang, Yan Hong, Yuanming Chen, Wei He, Guoyun Zhou & Binyun Liu. (2023) Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects. Molecules 28:6, pages 2783.
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Junye Chen, Guanbin Lu, Yuan Zhang, Yuanrong Cheng & Fei Xiao. (2023) A hybrid additive with both suppressor and leveler capability for damascene copper electrodeposition. Journal of Materials Science: Materials in Electronics 34:3.
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Yu Zhang, Xixun Shen, Miaomiao Zhou, Wei Huang & Qunjie Xu. (2022) The effect of quaternary ammonium salts with different chain lengths on copper filling behavior in blind holes of printed circuit board. Journal of Micromechanics and Microengineering 32:12, pages 125004.
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Neta Yitzhack & Yair Ein-Eli. (2022) A Single Step Assembly of Carbon Nanotube Fabric Containing Embedded Copper Particles Produced from Advanced Electrolytic Baths. Journal of The Electrochemical Society 169:8, pages 082502.
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Y. Hu, K. Ahammed, Q. Liu, R. Williams & Q. Huang. (2022) Effects of ethylenediamine tetrakis(ethoxylate-block-propoxylate) tetrol on tin electrodeposition. Electrochimica Acta 421, pages 140476.
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Sabrina M. Rosa-Ortiz, Kat-Kim Phan, Nida Khattak, Sylvia W. Thomas & Arash Takshi. (2021) Hydrogen evolution assisted cyclic electroplating for lateral copper growth in wearable electronics. Journal of Electroanalytical Chemistry 902, pages 115796.
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Minjae Sung, Yoonjae Lee, Myunghyun Lee, Youngkeun Jeon, Taeho Lim, Young Gyu Kim & Jae Jeong Kim. (2021) Polyethylene Glycol-Based Single Organic Additive for Through Silicon Via Filling and its Structural Modification Effect. Journal of The Electrochemical Society 168:1, pages 012506.
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Minjae Sung, Young Yoon, Jinwoo Hong, Myung Jun Kim & Jae Jeong Kim. (2019) Bromide Ion as a Leveler for High-Speed TSV Filling. Journal of The Electrochemical Society 166:13, pages D546-D550.
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Hiroki Yoshida, Takaaki Yamazaki, Takayoshi Adachi, Naoki Fukumuro, Shinji Yae & Yuh Fukai. (2015) Hydrogen-Induced Grain Growth in Electrodeposited Cu Films. Journal of the Japan Institute of Metals Journal of the Japan Institute of Metals and Materials 79:3, pages 78-81.
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