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Welding International Volume 35, 2021 - Issue 1-3
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Research Article

Effect of isothermal ageing on the microstructure, shear behaviour and hardness of the Sn58Bi/SnAgCuBiNi/Cu solder joints

Jian Changa School of Material Science and Engineering, Harbin University of Science and Technology, Harbin, China;b College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China
,
Yang Liub College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, ChinaCorrespondence[email protected]
ORCID Iconhttps://orcid.org/0000-0002-4311-2198
ORCID Icon,
Hao Zhangc Department of Microelectronics, Delft University of Technology, Delft, The Netherlands
,
Min Zhoub College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China
,
Xue Yuxiongb College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China
,
Xianghua Zengb College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China
,
Rongxing Caob College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China
&
Penghui Chenb College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China
 show all
Pages 3-11 | Received 16 Dec 2020, Accepted 09 Feb 2021, Published online: 03 Mar 2021
 
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ABSTRACT

The microstructure, shear behaviour and hardness of the SnBi/SACBN/Cu solder joint before and after isothermal ageing were investigated in comparison with the SnBi/Cu and SACBN/Cu solder joints. The experimental results indicated that the pre-soldered SACBN joint had a significant effect on the formation and growth of the β-Sn grains in the SnBi bulk solder. The brittleness of the SnBi/SACBN/Cu composite solder joint was also suppressed and its failure mode transformed from brittle failure to brittle-ductile failure after reflow. However, the shear strength and failure mode of the SnBi/SACBN/Cu composite solder joint became similar to those of the SnBi/Cu joints after 600 h isothermal ageing. The shear strength of the three kinds of solder joints decreased after isothermal ageing, but the SnBi/SACBN/Cu composite solder joint showed higher shear strength than SnBi/Cu did during ageing. The shear strength of the composite solder joint was 67.1MPa after ageing. Due to the diffusion of elements in the isothermal ageing process, the microstructure of the composite solder joint was significantly coarsened after ageing for 600 hours. This phenomenon further led to the decrease of the hardness and shear strength of the three kinds of solder joints.

Disclosure Statement

No potential conflict of interest was reported by the author(s).

This article is part of the following collections:
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