A survey of surface tension, molar volume and density for Sn–Ag–Cu–Bi–Sb quinary alloys as lead-free solders

ABSTRACT

By applying the geometric models and the theoretical equation, the surface tension, the molar volume and the density were studied. The empirical calculations were carried out in temperature range 623 K ≤ T ≤ 1123 K. Only few thermophysical properties were estimated for eight quinary alloys: Sn3.55Ag0.5Cu3Bi3Sb, Sn3.48Ag0.5Cu3Bi5Sb, Sn3.48 Ag0.5Cu5Bi3Sb, Sn3.40 Ag0.5Cu5Bi5Sb, Sn3.53Ag1Cu3Bi3Sb, Sn3.46Ag1Cu3Bi5Sb, Sn3.46Ag1Cu5Bi3Sb, Sn3.38Ag1Cu5Bi5Sb. The results show that surface tension and density have a linear appearance for all temperatures. We have also studied the influence of the composition and temperature in the studied alloys. The obtained theoretical results are compared with the experimental ones and with the conventional Pb–Sn welds.

KEYWORDS:

• Surface tension
• molar volume
• density
• Sn–Ag–Cu–Bi–Sb
• geometric model
• equation

Disclosure statement

No potential conflict of interest was reported by the authors.

ORCID

Noureddine Ouerfelli http://orcid.org/0000-0002-8343-0510

Correction Statement

This article has been republished with minor changes. These changes do not impact the academic content of the article.