A survey of surface tension, molar volume and density for Sn–Ag–Cu–Bi–Sb quinary alloys as lead-free solders

References

• A. Dugenske, A. Fraser, T. Nguyen and R. Voitus, The National Electronics Manufacturing initiative (NEMI) plug and play factory project. Int. J. Comp. Integ. M. 13 (2000), pp. 225–244. doi: 10.1080/095119200129876
   Web of Science ®Google Scholar
• Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
   Google Scholar
• Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (ROHS).
   Google Scholar
• K. Zeng and K.N. Tu, Six cases of reliability study of Pb-free solder joint in electronic packaging Technology. Mater. Sci. Eng. 38 (2002), pp. 55–105. doi: 10.1016/S0927-796X(02)00007-4
   Google Scholar
• R. Kisiel, W. Gąsior, Z. Moser, J. Pstruś, K. Bukat and J. Sitek, Electrical and mechanical studies of the Sn–Ag–Cu–Bi and Sn–Ag–Cu–Bi–Sb lead free soldering materials. Arch. Metall. Mater. 50 (2005), pp. 1065–1071.
   Web of Science ®Google Scholar
• Z. Moser, W. Gasior, K. Bukat, J. Pstruś, R. Kisiel, J. Sitek and I. Ohnuma, Pb-free solders: Part iii. wettability testing of Sn–Ag–Cu–Bi alloys with Sb additions. J. Phase Equilib. Diffus. 28 (2007), pp. 433–438. doi: 10.1007/s11669-007-9156-0
   Web of Science ®Google Scholar
• Z. Moser, P. Sebo, W. Gąsior, P. Svec and J. Pstruś, Effect of indium on wettability of Sn–Ag–Cu solders. Experiment vs. modeling, Part I. Calphad 33 (2009), pp. 63–68. doi: 10.1016/j.calphad.2008.10.001
   Web of Science ®Google Scholar
• A. Dogan and H. Arslan, An investigation on surface tensions of Pb-free solder materials. Philos. Mag. 96 (2016), pp. 2887–2901. doi: 10.1080/14786435.2016.1217361
   Web of Science ®Google Scholar
• A. Dogan and H. Arslan, Thermophysical properties of Cu–In–Sn liquid Pb-free alloys: viscosity and surface tension. Philos. Mag. 98 (2018), pp. 37–53. doi: 10.1080/14786435.2017.1392053
   Web of Science ®Google Scholar
• A. Dogan and H. Arslan, An investigation of influencing of Sb and Bi contents on surface tensions associated with Pb-free Sn–Zn–Sb–Bi quaternary and sub-quaternary solder alloys. Philos. Mag. 99 (2019), pp. 1825–1848. doi: 10.1080/14786435.2019.1605215
   Web of Science ®Google Scholar
• A. Dogan and H. Arslan, Thermodynamic description of the viscosity of liquid solder alloys with minor Co impurities. Philos. Mag. 99 (2019), pp. 267–283. doi: 10.1080/14786435.2018.1537530
   Web of Science ®Google Scholar
• A. Dogan and H. Arslan, Determination of surface tension of liquid ternary Ni–Cu–Fe and sub-binary alloys. Philos. Mag 99 (2019), pp. 1206–1224. doi: 10.1080/14786435.2019.1576937
   Web of Science ®Google Scholar
• F. Kohler, Zur Berechnung der thermodynamic chen dates enines tern ä ren aus den zurgehorigen bin ä ren systemen. Monatsh. Chem. 91 (1960), pp. 738–740. doi: 10.1007/BF00899814
   Google Scholar
• Y.M. Muggianu, M. Gambino and J.P. Bross, Enthalpies de formation des alliages liquides bismuth étain- gallium à 723K. J. Chim. Phys. 22 (1975), pp. 83–88. doi: 10.1051/jcp/1975720083
   Google Scholar
• G.W. Toop, Predicting ternary activities using binary data. Trans. Metall. Soc. AIME 233 (1965), pp. 850–855.
   Google Scholar
• M. Hillert, Empirical methods of predicting and representing thermodynamic properties of ternary solution phases. Calphad 4 (1980), pp. 1–12. doi: 10.1016/0364-5916(80)90016-4
   Web of Science ®Google Scholar
• K.C. Chou, A general solution model for predicting ternary thermodynamic properties. Calphad 19 (1995), pp. 315–325. doi: 10.1016/0364-5916(95)00029-E
   Web of Science ®Google Scholar
• J.A.V. Butler, The thermodynamics of the surfaces of solutions. Proc. R. Soc. Lond. A 135 (1932), pp. 348–375. doi: 10.1098/rspa.1932.0040
   Google Scholar
• Y. WASEDA, The Structure of Non-Crystalline Materials: Liquids and Amorphous Solids, McGraw-Hill, New York, 1980.
   Google Scholar
• M. Kucharski and P. Fima, The surface tension and density of liquid Ag–Bi, Ag–Sn and Bi–Sn alloys. Monatsh. Chem. 136 (2005), pp. 1841–1846. doi: 10.1007/s00706-005-0393-9
   Web of Science ®Google Scholar
• M. Kucharski, P. Fima, P. Skrzyniarz and W. Przebinda-Stefanowa, Surface tension and density of Cu–Ag, Cu–In and Ag–In alloys. Arch. Metall. Mater. 51 (2006), pp. 389–397.
   Web of Science ®Google Scholar
• Z. Moser, W. Gąsior, J. Pstruś, I. Ohnuma and K. Ishida, Influence of Sb additions on surface tension and density of Sn–Sb, Sn–Ag–Sb and Sn–Ag–Cu–Sb alloys: Experiment vs. modeling. Z. MetaIlkd. 97 (2006), pp. 365–370. doi: 10.3139/146.101225
   Google Scholar
• W. Gąsior, Z. Moser and J. Pstruś, Measurements of the surface tension and density of tin based Sn–Ag–Cu–Sb liquid alloys. Arch. Metall. Mater. 49 (2004), pp. 155–167.
   Web of Science ®Google Scholar
• T. Iida and R.I.L. Guthrie, The Physical Properties of Liquid Metals, Clarendon Press, Oxford, 1987.
   Google Scholar
• J.W. Taylor, The surface tension of liquid–metal solutions. Acta Metall. 4 (1956), pp. 460–468. doi: 10.1016/0001-6160(56)90042-6
   Google Scholar
• H. Ohtani and K. Ishida, A thermodynamic study of the phase equilibria in the Bi–Sn–Sb system. J. Electron. Mater. 23 (1994), pp. 747–755. doi: 10.1007/BF02651369
   Web of Science ®Google Scholar
• W. Gasior, Z. Moser and J. Pstruś, Surface tension, density, and molar volume of liquid Sb–Sn alloys: experiment versus modeling. J. Phase Equilib. 24 (2003), pp. 504–510. doi: 10.1361/105497103772084543
   Google Scholar
• O. Redlich and A.T. Kister, Algebraic representation of thermodynamic properties and the classification of solutions. Ind. Eng. Chem. 40 (1948), pp. 345–348. doi: 10.1021/ie50458a036
   Web of Science ®Google Scholar
• T. Tanaka and T. Iida, Application of a thermodynamic database to the calculation of surface tension for iron-base liquid alloys. Steel Res. Int. 65 (1994), pp. 21–28. doi: 10.1002/srin.199400921
   Web of Science ®Google Scholar
• T. Tanaka, K. Hack, T. Iida and S. Hara, Application of thermodynamic databases to the evaluation of surface tensions of molten alloys, salt mixtures and oxide mixtures. Z. MetaIlkd. 87 (1996), pp. 380–389.
   Google Scholar
• E. Gebhardt and G. Wörwag, Die innere Reibung Flussinger Legierung ans KupferSilber und Gold-Kupfer. Z. Metallkd. 42 (1951), pp. 358–361.
   Google Scholar
• Database of Lead-free soldering Materials Institute of Metallurgy and Materials Science Polish Academy of Sciences 30-059 Kraków, 25 Reymonta Street, Poland, SURDAT-Database of Pb-free soldering materials is available on web site http://www.imim.pl
   Google Scholar
• R. M’chaar, A. Sabbar and M. El Moudane, Temperature dependences of surface tension, density and viscosity study of Sn–Ag–Cu with Bi additions using theoretical models. Sci. Rep. 9 (2019), pp. 14177. doi: 10.1038/s41598-019-50698-9
   PubMed Web of Science ®Google Scholar
• W. Gasior, Z. Moser and J. Pstrus, Density and surface tension of the Pb–Sn liquid alloys. J. Phase Equilib 22 (2001), pp. 20–25. doi: 10.1007/s11669-001-0051-9
   Google Scholar
• R. M’chaar, S. Belmoujoud, A. Sabbar, M. El Moudane and A. Ghanimi, Modeling of some physicochemical properties in the liquid Au–Bi–Sn alloys relevant for Pb-free soldering. J. Theor. Comput. Chem. 16 (2017), pp. 1750015. doi: 10.1142/S0219633617500158
   Web of Science ®Google Scholar
• R. M’chaar, A. Sabbar, M. El Moudane and A. Ghanimi, Theoretical investigation of some physicochemical properties in the liquid Sn-Ag-Cu alloys. J. Theor. Comput. Chem. 16 (2017), pp. 1750040. doi: 10.1142/S0219633617500407
   Web of Science ®Google Scholar