Preparation, Characterization, and Properties of Novel Polyimide–SiO₂ Hybrid Composites Based on Bipyridine for Low Dielectric Applications

Abstract

Novel low dielectric polyimide–SiO₂ hybrid materials containing bipyridine were prepared with three-step sol–gel process from poly(amic acid)s. (3-Aminopropyl)triethoxysilane as coupling agent was used to increase the intrachain chemical bonding between the polyimide and SiO₂ groups. The thermal, dielectric, and physical properties of the hybrid materials were investigated and correlated with the porous structure. The glass transition temperatures of all the hybrids were found to be higher than polyimides. The effect of SiO₂ groups on the porous structure and dielectric properties was investigated. The dielectric constant of the hybrid materials was observed a decrease from 3.30 to 2.15 with increased SiO₂ amount.

GRAPHICAL ABSTRACT

Keywords:

• Hybrid materials
• Low dielectric properties
• Polyimide
• SiO₂