Abstract
The electromagnetic interference (EMI) caused by the noise resulting from a common mode of stacked I/O connectors is analyzed using both numerical simulation and experimental measurements. The use of stacked connectors exists on the PCBs of today’s information technology equipment in order to reduce size; however, size reductions will cause increased severe EMI. After diagnosis and analysis, a strategy is presented to suppress the EMI noise level, as well as its emissions, and is found to be very effective as shown by our experiments.
Disclosure statement
No potential conflict of interest was reported by the authors.